Inventor · disambiguated record
Takashi Yoshimura
Also filed as: YOSHIMURA TAKASHI
111 granted patents·58 pending applications·690 citations·filing 1984–2025
99Inventor score
Files withFUJI ELECTRIC CO LTD95DAIKIN IND LTD25OMRON TATEISI ELECTRONICS CO5MAZDA MOTOR4DAICEL CORP3
Top patents by PatentIndex Score
169 records- 0198US4650212AVehicle suspension systemMAZDA MOTOR·Filed 1986·Granted Mar 17, 1987·141 cites·13 claims
- 0296US9276071B2Semiconductor device and method for producing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2014·Granted Mar 1, 2016·18 cites·10 claims
- 0396US8766413B2Semiconductor device and method for manufacturing semiconductor deviceNEMOTO MICHIO·Filed 2010·Granted Jul 1, 2014·25 cites·20 claims
- 0496US4931417ATransition-metal compound having a bis-substituted-cyclopentadienyl ligand of bridged structureCHISSO CORP·Filed 1988·Granted Jun 5, 1990·130 cites·2 claims
- 0595US11342186B2Semiconductor device and manufacturing method thereofFUJI ELECTRIC CO LTD·Filed 2020·Granted May 24, 2022·3 cites·26 claims
- 0695US9773923B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Sep 26, 2017·10 cites·21 claims
- 0794US10304928B2Semiconductor device and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2017·Granted May 28, 2019·10 cites·29 claims
- 0894US10189927B2Ionomer having high oxygen permeabilityDAIKIN IND LTD·Filed 2015·Granted Jan 29, 2019·8 cites·9 claims
- 0993US10043865B2Semiconductor device and method for manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Aug 7, 2018·7 cites·27 claims
- 1091US11335772B2Semiconductor device and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2020·Granted May 17, 2022·2 cites·28 claims
- 1191US10847608B2Semiconductor device and method for manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2020·Granted Nov 24, 2020·2 cites·12 claims
- 1291US10374102B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2018·Granted Aug 6, 2019·5 cites·17 claims
- 1389US10468254B2Semiconductor device and manufacturing method of semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2017·Granted Nov 5, 2019·5 cites·30 claims
- 1489US9722016B2Semiconductor device and method for producing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted Aug 1, 2017·4 cites·8 claims
- 1589US9368577B2Semiconductor device and method for producing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2014·Granted Jun 14, 2016·6 cites·8 claims
- 1688US12317560B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2024·Granted May 27, 2025·0 cites·19 claims
- 1788US10056451B2Semiconductor device and method for producing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2017·Granted Aug 21, 2018·3 cites·21 claims
- 1887US10056449B2Semiconductor device and method for producing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2017·Granted Aug 21, 2018·3 cites·9 claims
- 1986US11935945B2Semiconductor device and manufacturing method of semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2021·Granted Mar 19, 2024·1 cites·20 claims
- 2086US6696014B2Iron-based sintered powder metal body, manufacturing method thereof and manufacturing method of iron-based sintered component with high strength and high densityJFE STEEL CORP·Filed 2002·Granted Feb 24, 2004·20 cites·16 claims
- 2185US9385211B2Manufacturing method for semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2013·Granted Jul 5, 2016·6 cites·3 claims
- 2285US2025287664A1Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2025·Application pending·0 cites
- 2384US12300726B2Semiconductor device and semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 2484US12205993B2Semiconductor device, and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·18 claims
- 2584US10651269B2Semiconductor device and method for producing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2019·Granted May 12, 2020·2 cites·9 claims
- 2684US10199453B2Semiconductor device and method for producing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2018·Granted Feb 5, 2019·2 cites·9 claims
- 2784US2025132160A1Semiconductor device and manufacturing method thereofFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 2884US2025311341A1Semiconductor device and semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2025·Application pending·0 cites
- 2983US12191148B2Semiconductor device and manufacturing method thereofFUJI ELECTRIC CO LTD·Filed 2023·Granted Jan 7, 2025·0 cites·29 claims
- 3083US9520475B2Semiconductor device and method for producing the sameFUJI ELECTRIC CO LTD·Filed 2014·Granted Dec 13, 2016·4 cites·15 claims
- 3181US12368048B2Semiconductor device and method for manufacturingFUJI ELECTRIC CO LTD·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 3281US9156504B2Vehicle underbody structure for vehicleMAZDA MOTOR·Filed 2012·Granted Oct 13, 2015·10 cites·12 claims
- 3380US9530672B2Production method for a semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2013·Granted Dec 27, 2016·4 cites·22 claims
- 3480US4932493AIgnition switch, brake and gearshift interlocks for a vehicle automatic transmissionMAZDA MOTOR·Filed 1989·Granted Jun 12, 1990·38 cites·8 claims
- 3580US2025368878A1Refrigerant-containing composition, use of same, freezer having same, and method for operating freezerDAIKIN IND LTD·Filed 2025·Application pending·0 cites
- 3679US12015058B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2023·Granted Jun 18, 2024·0 cites·17 claims
- 3778US12349376B1Semiconductor device and manufacturing method of semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2024·Granted Jul 1, 2025·0 cites·29 claims
- 3878US11735424B2Semiconductor device and manufacturing method thereofFUJI ELECTRIC CO LTD·Filed 2022·Granted Aug 22, 2023·0 cites·33 claims
- 3978US10825904B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2018·Granted Nov 3, 2020·1 cites·17 claims
- 4078US9324847B2Semiconductor device and semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2013·Granted Apr 26, 2016·3 cites·8 claims
- 4178US6559023B2Method of fabricating a semiconductor device with phosphorous and boron ion implantation, and by annealing to control impurity concentration thereofFUJI ELECTRIC CO LTD·Filed 2002·Granted May 6, 2003·26 cites·18 claims
- 4278US6514307B2Iron-based sintered powder metal body, manufacturing method thereof and manufacturing method of iron-based sintered component with high strength and high densityKAWASAKI STEEL CO·Filed 2001·Granted Feb 4, 2003·10 cites·2 claims
- 4378US2024332373A1Semiconductor device and manufacturing methodFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 4478US2025159954A1Semiconductor device, and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2025·Application pending·0 cites
- 4577US11824095B2Semiconductor device and semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2022·Granted Nov 21, 2023·0 cites·12 claims
- 4677US9947761B2Production method for semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2013·Granted Apr 17, 2018·3 cites·21 claims
- 4775US11646350B2Semiconductor device, and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2021·Granted May 9, 2023·0 cites·20 claims
- 4875US11469297B2Semiconductor device and method for producing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2021·Granted Oct 11, 2022·0 cites·28 claims
- 4975US10998398B2Semiconductor device and method for manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2020·Granted May 4, 2021·0 cites·20 claims
- 5075US10756182B2Semiconductor device and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2019·Granted Aug 25, 2020·1 cites·27 claims
Showing the top 50 of 169 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →