Inventor · disambiguated record
Takahiro Yoshioka
Also filed as: YOSHIOKA TAKAHIRO
29 granted patents·20 pending applications·117 citations·filing 1980–2023
95Inventor score
Files withTOKYO OHKA KOGYO CO LTD18FUJITSU LTD8FUJISHIRO KOICHI4IMAI HIROFUMI3NIPPON STEEL CHEMICAL & MAT CO LTD3
Top patents by PatentIndex Score
49 records- 0191US9308715B2Laminate and method for separating the sameTOKYO OHKA KOGYO CO LTD·Filed 2014·Granted Apr 12, 2016·10 cites·3 claims
- 0291US8797637B2Color display device for electronic paper, and process for production thereofFUJISHIRO KOICHI·Filed 2011·Granted Aug 5, 2014·21 cites·8 claims
- 0384US9627235B2Supporting member separation methodTOKYO OHKA KOGYO CO LTD·Filed 2015·Granted Apr 18, 2017·4 cites·13 claims
- 0484US8298365B2Sticking method and sticking apparatusIMAI HIROFUMI·Filed 2010·Granted Oct 30, 2012·7 cites·11 claims
- 0580US9881829B2Adhesive composition, laminate, and stripping methodTOKYO OHKA KOGYO CO LTD·Filed 2017·Granted Jan 30, 2018·2 cites·18 claims
- 0678US9097822B2Lenticular lens sheet and process for production thereof, and optical elementFUJISHIRO KOICHI·Filed 2011·Granted Aug 4, 2015·6 cites·12 claims
- 0776US8357750B2Adhesive composition and film adhesiveTOKYO OHKA KOGYO CO LTD·Filed 2010·Granted Jan 22, 2013·1 cites·4 claims
- 0875US10147022B2Detection method and systemFUJITSU LTD·Filed 2016·Granted Dec 4, 2018·2 cites·16 claims
- 0968US10875275B2Composition for forming separation layer, support base provided with separation layer, laminate and method of producing same, and method of producing electronic componentTOKYO OHKA KOGYO CO LTD·Filed 2018·Granted Dec 29, 2020·0 cites·8 claims
- 1068US9607875B2Adhesive composition, laminate, and stripping methodTOKYO OHKA KOGYO CO LTD·Filed 2015·Granted Mar 28, 2017·1 cites·10 claims
- 1166US2024327771A1Chip for cell culturing, device for cell culturing, method for manufacturing chip for cell culturing, and method for culturing cellsTOKYO OHKA KOGYO CO LTD·Filed 2022·Application pending·0 cites
- 1265US6089067AFurnace coilerHITACHI LTD·Filed 1999·Granted Jul 18, 2000·11 cites·5 claims
- 1363US9115297B2Adhesive compositionIMAI HIROFUMI·Filed 2011·Granted Aug 25, 2015·1 cites·10 claims
- 1463US8809457B2Adhesive composition, adhesive film, and method for treating substrateTOKYO OHKA KOGYO CO LTD·Filed 2012·Granted Aug 19, 2014·0 cites·17 claims
- 1562US12206979B2Computer-readable recording medium storing update program, update method, and information processing apparatusFUJITSU LTD·Filed 2022·Granted Jan 21, 2025·0 cites·9 claims
- 1662US9524446B2Image processing device and image processing methodFUJITSU LTD·Filed 2014·Granted Dec 20, 2016·2 cites·19 claims
- 1762US7770406B2RefrigeratorTOSHIBA KK·Filed 2004·Granted Aug 10, 2010·13 cites·14 claims
- 1862US2023279278A1Adhesive resin composition and adhesive filmNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2021·Application pending·0 cites
- 1958US2022097345A1Metal-fiber reinforced plastic composite materialNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2019·Application pending·0 cites
- 2058US2024144514A1Recording medium, comparison support method, and information processing deviceFUJITSU LTD·Filed 2023·Application pending·0 cites
- 2158US2009159004A1Vertical chemical vapor deposition apparatus having nozzle for spraying reaction gas toward wafersELPIDA MEMORY INC·Filed 2008·Application pending·0 cites
- 2257US9682532B2Laminated body and method for separating laminated bodyKUBO ATSUSHI·Filed 2011·Granted Jun 20, 2017·1 cites·4 claims
- 2357US2024144714A1Recording medium, comparison support method, and information processing deviceFUJITSU LTD·Filed 2023·Application pending·0 cites
- 2456US10793756B2Adhesive composition, adhesive film, and bonding methodTOKYO OHKA KOGYO CO LTD·Filed 2018·Granted Oct 6, 2020·0 cites·9 claims
- 2554US7475557B2RefrigeratorTOSHIBA KK·Filed 2004·Granted Jan 13, 2009·9 cites·2 claims
- 2654US4271061AEpoxy resin compositions for sealing semiconductorsNITTO ELECTRIC IND CO·Filed 1980·Granted Jun 2, 1981·16 cites·20 claims
- 2754US2019091979A1Laminate production method, substrate processing method, and laminateTOKYO OHKA KOGYO CO LTD·Filed 2018·Application pending·0 cites
- 2851US8980997B2Adhesive compositionTAMURA KOKI·Filed 2011·Granted Mar 17, 2015·0 cites·4 claims
- 2951US6905501B2Bone connecting device and method of manufacturing the sameGUNZE KK·Filed 2002·Granted Jun 14, 2005·10 cites·1 claims
- 3051US2022351504A1Method and apparatus for evaluating material propertyHITACHI METALS LTD·Filed 2022·Application pending·0 cites
- 3151US2015059976A1Adhesive composition, adhesive film, and bonding methodTOKYO OHKA KOGYO CO LTD·Filed 2013·Application pending·0 cites
- 3250US2020109319A1Adhesion improver for carbon-fiber-reinforced resin compositionNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2018·Application pending·0 cites
- 3349US9682541B2Bonding methodTOKYO OHKA KOGYO CO LTD·Filed 2014·Granted Jun 20, 2017·0 cites·8 claims
- 3447US2022254033A1Movement history change method, storage medium, and movement history change deviceFUJITSU LTD·Filed 2021·Application pending·0 cites
- 3547US2012118511A1Laminate and method for separating the sameIMAI HIROFUMI·Filed 2011·Application pending·0 cites
- 3646US8354157B2Support plate, method for producing the same, and method for processing substrateTOKYO OHKA KOGYO CO LTD·Filed 2010·Granted Jan 15, 2013·0 cites·16 claims
- 3746US2017326850A1Laminate production method, substrate processing method, and laminateTOKYO OHKA KOGYO CO LTD·Filed 2015·Application pending·0 cites
- 3843US10081172B2Method of preparing laminate, and method of separating supportTOKYO OHKA KOGYO CO LTD·Filed 2016·Granted Sep 25, 2018·0 cites·16 claims
- 3942US2014044962A1Adhesive composition, film adhesive, and bonding methodTOKYO OHKA KOGYO CO LTD·Filed 2013·Application pending·0 cites
- 4041US2017116736A1Line of sight detection system and methodFUJITSU LTD·Filed 2016·Application pending·0 cites
- 4141US2017344110A1Line-of-sight detector and line-of-sight detection methodFUJITSU LTD·Filed 2017·Application pending·0 cites
- 4241US2014255638A1Adhesive composition for bonding a wafer and supporting body for said wafer, adhesive film, and laminateTOKYO OHKA KOGYO CO LTD·Filed 2012·Application pending·0 cites
- 4339US9944049B2Composition for forming release layer, release layer, laminate including release layer, method of preparing laminate, and method of treating laminateTOKYO OHKA KOGYO CO LTD·Filed 2016·Granted Apr 17, 2018·0 cites·2 claims
- 4439US8796352B2Ultraviolet ray-curable resin composition used in inkjet printing and optical element obtained using sameFUJISHIRO KOICHI·Filed 2011·Granted Aug 5, 2014·0 cites·8 claims
- 4538US9064915B2Support method, high-temperature treatment method using same, and support jigKUBO ATSUSHI·Filed 2012·Granted Jun 23, 2015·0 cites·6 claims
- 4638US8333869B2Stripping method and stripping solutionTAMURA KOKI·Filed 2011·Granted Dec 18, 2012·0 cites·7 claims
- 4737US2013094079A1Method for producing lenticular lens, lenticular lens, optical element and three-dimensional display deviceFUJISHIRO KOICHI·Filed 2011·Application pending·0 cites
- 4836US2007144190A1RefrigeratorTOSHIBA HA PRODUCTS CO LTD·Filed 2004·Application pending·0 cites
- 4934US2012073741A1Adhesive compositionASAI TAKAHIRO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →