Inventor · disambiguated record
Takuma Yoshisaka
Also filed as: YOSHISAKA TAKUMA
1 granted patent·3 pending applications·0 citations·filing 2010–2010
6Inventor score
Files withKAIMORI SHINGO4
Top patents by PatentIndex Score
4 records- 0136US2012048598A1Adhesive resin composition, and laminate and flexible printed wiring board using the sameKAIMORI SHINGO·Filed 2010·Application pending·0 cites
- 0236US2011303439A1Adhesive resin compositions, and laminates and flexible printed wiring boards using sameKAIMORI SHINGO·Filed 2010·Application pending·0 cites
- 0332US9181464B2Adhesive resin compositions, and laminates and flexible printed wiring boards using sameKAIMORI SHINGO·Filed 2010·Granted Nov 10, 2015·0 cites·5 claims
- 0431US2012043118A1Adhesive resin composition, and laminate and flexible printed wiring board using the sameKAIMORI SHINGO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →