Inventor · disambiguated record
Tchefor Ndukum
Also filed as: NDUKUM TCHEFOR
0 granted patents·9 pending applications·0 citations·filing 2021–2023
Files withINTEL CORP9
Top patents by PatentIndex Score
9 records- 0157US2024181572A1Dry method for metal-defined pad formationINTEL CORP·Filed 2022·Application pending·0 cites
- 0257US2025112124A1Deep cavity arrangements on integrated circuit packagingINTEL CORP·Filed 2023·Application pending·0 cites
- 0354US2024079337A1Microelectronic assemblies having power delivery routed through a bridge dieINTEL CORP·Filed 2022·Application pending·0 cites
- 0453US2025210586A1Semiconductor package substrate dicing and edge passivationINTEL CORP·Filed 2023·Application pending·0 cites
- 0553US2025112162A1Deep cavity metallization and fiducial arrangements for embedded die and assembly thereof on integrated circuit packagingINTEL CORP·Filed 2023·Application pending·0 cites
- 0652US2023420378A1Packaging architecture with cavities for embedded interconnect bridgesINTEL CORP·Filed 2022·Application pending·0 cites
- 0750US2025112140A1Stress mitigation architectures for glass core substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 0849US2024332153A1Dry seed removal by laser for line-space and via formationINTEL CORP·Filed 2023·Application pending·0 cites
- 0948US2023092903A1Methods and apparatus to embed host dies in a substrateINTEL CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →