Inventor · disambiguated record
Terry Burnette
Also filed as: BURNETTE TERRY · BURNETTE TERRY E · BURNETTE TERRY EDWARD
5 granted patents·1 pending application·181 citations·filing 1997–2004
83Inventor score
Top patents by PatentIndex Score
6 records- 0191US6552436B2Semiconductor device having a ball grid array and method thereforMOTOROLA INC·Filed 2000·Granted Apr 22, 2003·83 cites·16 claims
- 0279US5956606AMethod for bumping and packaging semiconductor dieMOTOROLA INC·Filed 1997·Granted Sep 21, 1999·63 cites·19 claims
- 0362US7067907B2Semiconductor package having angulated interconnect surfacesFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jun 27, 2006·12 cites·17 claims
- 0455US6117759AMethod for multiplexed joining of solder bumps to various substrates during assembly of an integrated circuit packageMOTOROLA INC·Filed 1997·Granted Sep 12, 2000·19 cites·41 claims
- 0551US7074627B2Lead solder indicator and methodFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Jul 11, 2006·4 cites·9 claims
- 0636US2003102535A1Semiconductor device having a ball grid array and method thereforFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →