Inventor · disambiguated record
Te-Fu Chang
Also filed as: CHANG TE-FU
8 granted patents·10 pending applications·2 citations·filing 2019–2024
73Inventor score
Top patents by PatentIndex Score
18 records- 0179US11349046B2LED chip structure, chip transferring system and chip transferring methodASTI GLOBAL INC TAIWAN·Filed 2020·Granted May 31, 2022·1 cites·10 claims
- 0268US11222833B2Micro-heaters in a film structure mounted on a substrate between a plurality of electronic componentsSKIILEUX ELECTRICITY INC·Filed 2019·Granted Jan 11, 2022·1 cites·20 claims
- 0368US2024308200A1Device for transferring electronic component and method for transferring electronic componentSKIILEUX ELECTRICITY INC·Filed 2024·Application pending·0 cites
- 0460US2023068211A1Device for transferring electronic component and method for transferring electronic componentSKIILEUX ELECTRICITY INC·Filed 2022·Application pending·0 cites
- 0558US11956887B2Board, circuit board, and fixtureSKIILEUX ELECTRICITY INC·Filed 2022·Granted Apr 9, 2024·0 cites·13 claims
- 0652US12125735B2Method for selectively releasing a light-emitting diode chip and method of manufacturing light-emitting deviceASTI GLOBAL INC TAIWAN·Filed 2022·Granted Oct 22, 2024·0 cites·2 claims
- 0752US11355407B2Micro heater chip, wafer-level electronic chip assembly and chip assembly stacking systemSKIILEUX ELECTRICITY INC·Filed 2020·Granted Jun 7, 2022·0 cites·10 claims
- 0851US2023121505A1Electronic device, electronic element soldering method and light-emitting diode display manufacturing methodSKIILEUX ELECTRICITY INC·Filed 2022·Application pending·0 cites
- 0948US12125719B2Chip-transferring system and chip-transferring methodSKIILEUX ELECTRICITY INC·Filed 2021·Granted Oct 22, 2024·0 cites·9 claims
- 1047US2021399164A1Method of manufacturing a red light-emitting chip carrying structureASTI GLOBAL INC TAIWAN·Filed 2021·Application pending·0 cites
- 1147US2021123968A1Led wafer, led wafer detection device, and led wafer detection methodASTI GLOBAL INC TAIWAN·Filed 2020·Application pending·0 cites
- 1246US2022020723A1Chip-carrying structure and chip-bonding methodSKIILEUX ELECTRICITY INC·Filed 2021·Application pending·0 cites
- 1344US11215525B2Wafer-grade LED detection device and methodASTI GLOBAL INC TAIWAN·Filed 2020·Granted Jan 4, 2022·0 cites·10 claims
- 1444US11143692B2LED wafer, LED wafer detection device, and LED wafer detection methodASTI GLOBAL INC TAIWAN·Filed 2020·Granted Oct 12, 2021·0 cites·10 claims
- 1544US2021136909A1Interposer board having heating function and electronic deviceASTI GLOBAL INC TAIWAN·Filed 2020·Application pending·0 cites
- 1644US2021320088A1Led chip initial structure, substrate structure, chip transferring method and image display deviceASTI GLOBAL INC TAIWAN·Filed 2021·Application pending·0 cites
- 1744US2021134695A1Interposer board having heating function and electronic device using the sameASTI GLOBAL INC TAIWAN·Filed 2020·Application pending·0 cites
- 1844US2022322519A1Board and circuit boardSKIILEUX ELECTRICITY INC·Filed 2021·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Te-Fu Chang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →