Inventor · disambiguated record
Te-Fang Chu
Also filed as: CHU TE-FANG
6 granted patents·3 pending applications·6 citations·filing 2008–2020
71Inventor score
Top patents by PatentIndex Score
9 records- 0176US10181458B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jan 15, 2019·4 cites·6 claims
- 0273US10566320B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Feb 18, 2020·2 cites·6 claims
- 0354US2014203771A1Electronic package, fabrication method thereof and adhesive compoundSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 0449US11527472B2Electronic package, supporting structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Dec 13, 2022·0 cites·14 claims
- 0547US9490219B2Semiconductor package with shielding member and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 8, 2016·0 cites·16 claims
- 0646US9343401B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted May 17, 2016·0 cites·18 claims
- 0742US9526171B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Dec 20, 2016·0 cites·11 claims
- 0836US2009251878A1Electronic Assembly and Method for Making Electronic DevicesHSU TSUNG-HSIEN·Filed 2008·Application pending·0 cites
- 0935US2014264958A1Semiconductor package, fabrication method thereof and molding compoundSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →