Inventor · disambiguated record
Tetsuya Fujisawa
Also filed as: FUJISAWA TETSUYA
24 granted patents·3 pending applications·1,417 citations·filing 1996–2014
97Inventor score
Top patents by PatentIndex Score
27 records- 0198US6476503B1Semiconductor device having columnar electrode and method of manufacturing sameFUJITSU LTD·Filed 2000·Granted Nov 5, 2002·266 cites·11 claims
- 0295US6548898B2External connection terminal and semiconductor deviceFUJITSU LTD·Filed 2001·Granted Apr 15, 2003·98 cites·28 claims
- 0394US6433418B1Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanismFUJITSU LTD·Filed 1999·Granted Aug 13, 2002·178 cites·4 claims
- 0494US6060768ASemiconductor device, method of manufacturing the semiconductor device, and method of manufacturing lead frameFUJITSU LTD·Filed 1997·Granted May 9, 2000·192 cites·12 claims
- 0593US5801439ASemiconductor device and semiconductor device unit for a stack arrangementFUJITSU LTD·Filed 1997·Granted Sep 1, 1998·168 cites·20 claims
- 0690US9076789B2Semiconductor device having a high frequency external connection electrode positioned within a via holeFUJITSU SEMICONDUCTOR LTD·Filed 2014·Granted Jul 7, 2015·8 cites·7 claims
- 0790US6836025B2Semiconductor device configured to be surface mountableFUJITSU LTD·Filed 2003·Granted Dec 28, 2004·61 cites·16 claims
- 0886US6333564B1Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodesFUJITSU LTD·Filed 1999·Granted Dec 25, 2001·87 cites·14 claims
- 0984US6767219B2Contactor, method for manufacturing such contactor, and testing method using such contactorFUJITSU LTD·Filed 2002·Granted Jul 27, 2004·30 cites·34 claims
- 1084US6566239B2Semiconductor device manufacturing method having a step of forming a post terminal on a wiring by electroless platingFUJITSU LTD·Filed 2001·Granted May 20, 2003·38 cites·6 claims
- 1183US6784543B2External connection terminal and semiconductor deviceFUJITSU LTD·Filed 2003·Granted Aug 31, 2004·30 cites·35 claims
- 1282US5760471ASemiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic packageFUJITSU LTD·Filed 1997·Granted Jun 2, 1998·71 cites·12 claims
- 1379US8344490B2Semiconductor device having a high frequency electrode positioned with a via holeFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Jan 1, 2013·8 cites·1 claims
- 1477US6696754B2Semiconductor module including a plurality of semiconductor devices detachablyFUJITSU LTD·Filed 2002·Granted Feb 24, 2004·20 cites·10 claims
- 1575US8758685B2Automatic analyzer and operating method for sameKOMATSU HIDENOBU·Filed 2008·Granted Jun 24, 2014·7 cites·2 claims
- 1674US5786985ASemiconductor device and semiconductor device unitFUJITSU LTD·Filed 1996·Granted Jul 28, 1998·47 cites·22 claims
- 1773US7247950B2Semiconductor device and method of manufacturing the sameFUJITSU LTD·Filed 2004·Granted Jul 24, 2007·18 cites·13 claims
- 1868US7092900B2Electronic commerce method, recording medium storing electronic commerce program therein, and serverFUJITSU LTD·Filed 2001·Granted Aug 15, 2006·2 cites·12 claims
- 1968US6472744B2Semiconductor module including a plurality of semiconductor devices detachablyFUJITSU LTD·Filed 1998·Granted Oct 29, 2002·31 cites·17 claims
- 2063US7692294B2Semiconductor device and method for fabricating the sameFUJITSU MICROELECTRONICS LTD·Filed 2007·Granted Apr 6, 2010·2 cites·11 claims
- 2157US7251801B2Method of designing circuit boardFUJITSU LTD·Filed 2004·Granted Jul 31, 2007·6 cites·7 claims
- 2256US6094356ASemiconductor device and semiconductor device moduleFUJITSU LTD·Filed 1998·Granted Jul 25, 2000·21 cites·4 claims
- 2353US2013082402A1Semiconductor deviceFUJITSU SEMICONDUCTOR LTD·Filed 2012·Application pending·0 cites
- 2451US6084309ASemiconductor device and semiconductor device mounting structureFUJITSU LTD·Filed 1997·Granted Jul 4, 2000·20 cites·19 claims
- 2549US2006186524A1Semiconductor deviceFUJITSU LTD·Filed 2005·Application pending·0 cites
- 2643US2007138616A1Semiconductor device and manufacturing method of the sameFUJITSU LTD·Filed 2007·Application pending·0 cites
- 2739US5984699AMethod of fabricating a semiconductor deviceFUJITSU LTD·Filed 1997·Granted Nov 16, 1999·8 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →