Inventor · disambiguated record
Tetsuo Fukada
Also filed as: FUKADA TETSUO
9 granted patents·2 pending applications·294 citations·filing 1996–2017
90Inventor score
Top patents by PatentIndex Score
11 records- 0180US6107687ASemiconductor device having interconnection and adhesion layersMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Aug 22, 2000·63 cites·1 claims
- 0278US6184124B1Method of making embedded wiring systemMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Feb 6, 2001·50 cites·9 claims
- 0374US5892286ASemiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Apr 6, 1999·45 cites·18 claims
- 0474US5793112AMultilevel embedded wiring systemMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Aug 11, 1998·42 cites·18 claims
- 0569US6039808ACVD apparatus for Cu formationMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Mar 21, 2000·32 cites·5 claims
- 0666US6215189B1Semiconductor device having interconnect layer and method of manufacturing thereforMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Apr 10, 2001·32 cites·16 claims
- 0760US6335570B2Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jan 1, 2002·26 cites·5 claims
- 0841US10293494B2Bulk workpiece picking system and methodFANUC CORP·Filed 2017·Granted May 21, 2019·0 cites·4 claims
- 0941US2005095091A1Manufacturing cellFANUC LTD·Filed 2004·Application pending·0 cites
- 1035US2003222349A1Semiconductor device with multilayer interconnection structureMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 1134US6303495B2Method of forming thin copper film and semiconductor device with thin copper filmMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Oct 16, 2001·4 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →