Inventor · disambiguated record
Tetsuo Hirakawa
Also filed as: HIRAKAWA TETSUO
3 granted patents·82 citations·filing 1995–2002
73Inventor score
Technology areasH10W
Files withKYOCERA CORP3
Top patents by PatentIndex Score
3 records- 0171US5883428APackage for housing a semiconductor elementKYOCERA CORP·Filed 1997·Granted Mar 16, 1999·47 cites·13 claims
- 0255US5652466APackage for a semiconductor elementKYOCERA CORP·Filed 1995·Granted Jul 29, 1997·29 cites·3 claims
- 0350US6787706B2Ceramic circuit boardKYOCERA CORP·Filed 2002·Granted Sep 7, 2004·6 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →