Inventor · disambiguated record
Tetsuya Hirose
Also filed as: HIROSE TETSUYA
27 granted patents·18 pending applications·472 citations·filing 1987–2024
96Inventor score
Top patents by PatentIndex Score
45 records- 0194US6447913B1Thermoplastic polyester resin compositionPOLYPLASTICS CO·Filed 2000·Granted Sep 10, 2002·56 cites·17 claims
- 0291US5207102ASemiconductor pressure sensorMITSUBISHI ELECTRIC CORP·Filed 1991·Granted May 4, 1993·127 cites·5 claims
- 0389US8299182B2Acrylic pressure-sensitive adhesive composition and acrylic pressure-sensitive adhesive tapeINOKUCHI SHINJI·Filed 2011·Granted Oct 30, 2012·6 cites·4 claims
- 0488US8305134B2Reference current source circuit provided with plural power source circuits having temperature characteristicsHIROSE TETSUYA·Filed 2010·Granted Nov 6, 2012·16 cites·8 claims
- 0588US7642633B2Semiconductor device including capsule type semiconductor package and semiconductor chip in stacking mannerRENESAS TECH CORP·Filed 2006·Granted Jan 5, 2010·22 cites·9 claims
- 0688US4781969AFlexible printed circuit boardJUNKOSHA CO LTD·Filed 1987·Granted Nov 1, 1988·57 cites·2 claims
- 0787US9605189B2Pressure-sensitive adhesive compositionNITTO DENKO CORP·Filed 2014·Granted Mar 28, 2017·5 cites·20 claims
- 0885US5136123AMultilayer circuit boardJUNKOSHA CO LTD·Filed 1988·Granted Aug 4, 1992·46 cites·4 claims
- 0983US6660789B2Polyester resin composition and molding product thereofTORAY INDUSTRIES·Filed 2002·Granted Dec 9, 2003·23 cites·13 claims
- 1082US8330499B2Comparator circuit provided with differential amplifier making logical judgment by comparing input voltage with reference voltageHIROSE TETSUYA·Filed 2011·Granted Dec 11, 2012·12 cites·17 claims
- 1181US2024414709A1Supporting member, conduit supporting device, and processing apparatus provided therewithJUNKOSHA INC·Filed 2024·Application pending·0 cites
- 1280US5333505ASemiconductor pressure sensor for use at high temperature and pressure and method of manufacturing sameMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Aug 2, 1994·64 cites·19 claims
- 1379US12095243B2Supporting member, conduit supporting device, and processing apparatus provided therewithJUNKOSHA INC·Filed 2023·Granted Sep 17, 2024·0 cites·24 claims
- 1479US8421435B2Power supply voltage controlling circuit for use in subthreshold digital CMOS circuit including minute current generator and controlled output voltage generator circuitHIROSE TETSUYA·Filed 2010·Granted Apr 16, 2013·6 cites·27 claims
- 1574US11721966B2Supporting member, conduit supporting device, and processing apparatus provided therewithJUNKOSHA INC·Filed 2022·Granted Aug 8, 2023·0 cites·23 claims
- 1674US8436654B2Level converter circuit for use in CMOS circuit device provided for converting signal level of digital signal to higher levelHIROSE TETSUYA·Filed 2011·Granted May 7, 2013·4 cites·8 claims
- 1773US8828539B2Acrylic pressure-sensitive adhesive, acrylic pressure-sensitive adhesive layer and acrylic pressure-sensitive adhesive tape or sheetHIROSE TETSUYA·Filed 2009·Granted Sep 9, 2014·7 cites·13 claims
- 1866US8896378B2Differential amplifier circuit with ultralow power consumption provided with adaptive bias current generator circuitSEMICONDUCTOR TECH ACAD RES CT·Filed 2013·Granted Nov 25, 2014·4 cites·6 claims
- 1964US8803725B2Single slope AD converter circuit provided with compartor for comparing ramp voltage with analog input voltageSEMICONDUCTOR TECH ACAD RES CT·Filed 2013·Granted Aug 12, 2014·3 cites·13 claims
- 2062US11329470B2Supporting member, conduit supporting device, and processing apparatus provided therewithJUNKOSHA INC·Filed 2019·Granted May 10, 2022·0 cites·17 claims
- 2161US9896606B2Pressure-sensitive adhesive sheet and use thereofNITTO DENKO CORP·Filed 2014·Granted Feb 20, 2018·0 cites·20 claims
- 2259US2011076489A1Acrylic pressure-sensitive adhesive tape or sheetNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 2357US2014178683A1Sealing sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 2457US2014182778A1Sealing sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 2557US2014178684A1Sealing sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 2656US2015030795A1Pressure-sensitive adhesive tape and tape rollNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 2756US2010021730A1Acrylic pressure-sensitive adhesive tape or sheet, and method for producing the sameNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 2855US6530764B2Mold for resin-sealing of semiconductor devicesMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Mar 11, 2003·9 cites·17 claims
- 2954US2011076481A1Acrylic pressure-sensitive adhesive tape or sheetNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 3053US8614570B2Reference current source circuit including added bias voltage generator circuitHIROSE TETSUYA·Filed 2011·Granted Dec 24, 2013·1 cites·10 claims
- 3152US2012326391A1GasketHIROSE TETSUYA·Filed 2012·Application pending·0 cites
- 3252US2015369365A1GasketNITTO DENKO CORP·Filed 2015·Application pending·0 cites
- 3350US2011250433A1Acrylic pressure-sensitive adhesive tapeNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 3446US10472545B2Sealing sheetNITTO DENKO CORP·Filed 2013·Granted Nov 12, 2019·0 cites·10 claims
- 3545US2011223380A1Pressure-sensitive adhesive tapeNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 3645US2011223379A1Pressure-sensitive adhesive tapeNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 3743US8771602B2Resin production apparatus and resin production methodFUJIWARA SHUZO·Filed 2010·Granted Jul 8, 2014·0 cites·8 claims
- 3843US2012177901A1Acrylic pressure-sensitive tapeHIROSE TETSUYA·Filed 2010·Application pending·0 cites
- 3943US2014163138A1Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 4040US2012216948A1Process for producing pressure-sensitive adhesive sheetHIROSE ISAO·Filed 2010·Application pending·0 cites
- 4140US2013009365A1GasketKABUTOYA RYUUICHI·Filed 2012·Application pending·0 cites
- 4239US8350553B2Reference voltage generation circuit for supplying a constant reference voltage using a linear resistanceUNIV HOKKAIDO NAT UNIV CORP·Filed 2008·Granted Jan 8, 2013·0 cites·4 claims
- 4338US2009174051A1Semiconductor package and semiconductor deviceOSAKA SHUICHI·Filed 2005·Application pending·0 cites
- 4431US4858659AMethod for forming and cutting a flat type multi-core cable and apparatus for realizing sameHITACHI LTD·Filed 1988·Granted Aug 22, 1989·4 cites·13 claims
- 4522US8692623B2Relaxation oscillator circuit including two clock generator subcircuits having same configuration operating alternatelySHIGA SEICHIRO·Filed 2012·Granted Apr 8, 2014·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →