Inventor · disambiguated record
Tetsushi Hosoda
Also filed as: HOSODA TETSUSHI
2 granted patents·1 pending application·1 citations·filing 2016–2024
38Inventor score
Technology areasH10W
Files withDAINIPPON PRINTING CO LTD3
Top patents by PatentIndex Score
3 records- 0171US2025031315A1Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring boardDAINIPPON PRINTING CO LTD·Filed 2024·Application pending·0 cites
- 0264US12144120B2Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring boardDAINIPPON PRINTING CO LTD·Filed 2021·Granted Nov 12, 2024·0 cites·6 claims
- 0359US11191164B2Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring boardDAINIPPON PRINTING CO LTD·Filed 2016·Granted Nov 30, 2021·1 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →