Inventor · disambiguated record
Te-Chien Hou
Also filed as: HOU TE-CHIEN
11 granted patents·20 pending applications·6 citations·filing 2015–2025
83Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD31
Top patents by PatentIndex Score
31 records- 0186US10160091B2CMP polishing head design for improving removal rate uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 25, 2018·2 cites·20 claims
- 0284US12424449B2CMP system and method of useTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 23, 2025·0 cites·20 claims
- 0384US11865666B2CMP polishing head design for improving removal rate uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 9, 2024·0 cites·20 claims
- 0483US11069533B2CMP system and method of useTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 20, 2021·2 cites·20 claims
- 0582US11529712B2CMP polishing head design for improving removal rate uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 20, 2022·1 cites·17 claims
- 0681US11389928B2Method for conditioning polishing padTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 19, 2022·1 cites·20 claims
- 0780US2025353138A1Chemical-mechanical planarization pad and methods of useTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0878US2025357100A1Processing tool and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0978US2025345896A1Polishing Pad for Chemical Mechanical Polishing and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1076US12508685B2Semiconductor device fabrication methods and devices for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 1174US2024412977A1System and method for removing impurities during chemical mechanical planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1274US2024383093A1Apparatus and methods for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1372US11984323B2CMP system and method of useTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 14, 2024·0 cites·20 claims
- 1471US2025312886A1Device and method for improved cmp process with cmp headTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1570US2025312891A1Chemical mechanical polishing system with conditioning ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1670US2025353140A1Polishing apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1770US2025367786A1Cmp method and system with nanobubble cleaningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1869US2025312889A1Chemical mechanical polishing system with polishing pad height measurement sensor systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1968US12447580B2Apparatus and methods for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·18 claims
- 2067US2025312884A1Polishing pad with heat dissipation patternTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2166US2023398659A1Polishing Pad for Chemical Mechanical Polishing and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2265US12427618B2Chemical-mechanical planarization pad and methods of useTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 30, 2025·0 cites·20 claims
- 2363US12293917B2System and method for removing impurities during chemical mechanical planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 6, 2025·0 cites·21 claims
- 2463US2025303329A1Filter with metal-organic framework for cmp processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2562US2024383092A1Polishing tool and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2660US2023390882A1System, control method and apparatus for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2759US2025372435A1System and method for cleaning a wafer surfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2858US2025349562A1Apparatus and methods for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2957US2025339932A1Conditioning pad with deposited diamond coatingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3056US2025353134A1Heat cleaning system and method for cmp pad by-product controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3155US2024420978A1Retaining ring for chemical-mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →