Inventor · disambiguated record
Te-Hao Huang
Also filed as: HUANG TE-HAO
4 granted patents·1 pending application·1 citations·filing 2019–2023
59Inventor score
Files withFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD5
Top patents by PatentIndex Score
5 records- 0169US2023261046A1Method of forming semiconductor structureFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2023·Application pending·0 cites
- 0268US11164877B2Semiconductor device having void in bit line contact plugFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2019·Granted Nov 2, 2021·1 cites·10 claims
- 0367US11688764B2Semiconductor structure and method of forming sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Jun 27, 2023·0 cites·19 claims
- 0467US11678479B2Method of fabricating semiconductor device having void in bit line contact plugFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2021·Granted Jun 13, 2023·0 cites·16 claims
- 0558US11145715B2Semiconductor structure and method of forming sameFUJIAN JINHUA INTEGRATED CIRCUIT CO LTD·Filed 2019·Granted Oct 12, 2021·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →