Inventor · disambiguated record
Teng Hui
Also filed as: HUI TENG
2 granted patents·2 pending applications·26 citations·filing 2006–2011
61Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0166USD588080S2021-8J matrix leadframeGEM SERVICES INC·Filed 2007·Granted Mar 10, 2009·16 cites·1 claims
- 0254USD588557S4040-28J matrix leadframeGEM SERVICES INC·Filed 2007·Granted Mar 17, 2009·10 cites·1 claims
- 0346US2008135991A1Semiconductor device package featuring encapsulated leadframe with projecting bumps or ballsGEM SERVICES INC·Filed 2006·Application pending·0 cites
- 0439US2011291254A1Semiconductor device package featuring encapsulated leadframe with projecting bumps or ballsHARNDEN JAMES·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Teng Hui files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →