Inventor · disambiguated record
Teruhisa Ichise
Also filed as: ICHISE TERUHISA
18 granted patents·2 pending applications·150 citations·filing 2000–2015
94Inventor score
Files withRENESAS TECH CORP7ELPIDA MEMORY INC4HITACHI LTD3UCHIYAMA HIROYUKI3RENESAS ELECTRONICS CORP2
Top patents by PatentIndex Score
20 records- 0196US6603162B1Semiconductor integrated circuit device including dummy patterns located to reduce dishingHITACHI LTD·Filed 2000·Granted Aug 5, 2003·69 cites·2 claims
- 0291US7009233B2Semiconductor integrated circuit device including dummy patterns located to reduce dishingRENESAS TECH CORP·Filed 2003·Granted Mar 7, 2006·30 cites·69 claims
- 0388US8183091B2Semiconductor integrated circuit device and process for manufacturing the sameUCHIYAMA HIROYUKI·Filed 2010·Granted May 22, 2012·5 cites·28 claims
- 0483US7112870B2Semiconductor integrated circuit device including dummy patterns located to reduce dishingRENESAS TECH CORP·Filed 2005·Granted Sep 26, 2006·4 cites·144 claims
- 0576US7154164B2Semiconductor integrated circuit device and process for manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Dec 26, 2006·2 cites·12 claims
- 0675US7327014B2Semiconductor integrated circuit device and process for manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Feb 5, 2008·2 cites·10 claims
- 0771US6514854B2Method of producing semiconductor integrated circuit device having a plugHITACHI LTD·Filed 2001·Granted Feb 4, 2003·11 cites·10 claims
- 0865US6861359B2Process for semiconductor apparatus including forming an insulator and a semiconductor film on the backside of the wafer and removing the semiconductor film from the backsideRENESAS TECH CORP·Filed 2003·Granted Mar 1, 2005·13 cites·21 claims
- 0962US9059100B2Semiconductor integrated circuit device and process for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Jun 16, 2015·0 cites·4 claims
- 1062US6740924B2Semiconductor integrated circuit device and the method of producing the sameRENESAS TECH CORP·Filed 2002·Granted May 25, 2004·6 cites·21 claims
- 1161US9275956B2Semiconductor integrated circuit device and process for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Mar 1, 2016·0 cites·18 claims
- 1259US8569107B2Semiconductor integrated circuit device and process for manufacturing the sameUCHIYAMA HIROYUKI·Filed 2012·Granted Oct 29, 2013·0 cites·6 claims
- 1359US7696608B2Semiconductor integrated circuit device and process for manufacturing the sameHITACHI ULSI SYS CO LTD·Filed 2007·Granted Apr 13, 2010·0 cites·18 claims
- 1459US6828242B2Method for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 2002·Granted Dec 7, 2004·6 cites·11 claims
- 1558US8558352B2Semiconductor integrated circuit device and process for manufacturing the sameUCHIYAMA HIROYUKI·Filed 2011·Granted Oct 15, 2013·0 cites·3 claims
- 1653US7687849B2Method for manufacturing semiconductor integrated circuit deviceELPIDA MEMORY INC·Filed 2008·Granted Mar 30, 2010·0 cites·15 claims
- 1751US7417291B2Method for manufacturing semiconductor integrated circuit deviceELPIDA MEMORY INC·Filed 2007·Granted Aug 26, 2008·0 cites·14 claims
- 1847US7224034B2Method for manufacturing semiconductor integrated circuit deviceELPIDA MEMORY INC·Filed 2004·Granted May 29, 2007·2 cites·9 claims
- 1944US2009267160A1Semiconductor device and method for manufacturing the sameELPIDA MEMORY INC·Filed 2009·Application pending·0 cites
- 2044US2004173838A1Semiconductor integrated circuit device and the method of producing the sameRENESAS TECH CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →