Inventor · disambiguated record
Tejaswi K. Indukuri
Also filed as: INDUKURI TEJASWI · INDUKURI TEJASWI K
24 granted patents·7 pending applications·90 citations·filing 2008–2025
94Inventor score
Top patents by PatentIndex Score
31 records- 0195US9514983B2Cobalt based interconnects and methods of fabrication thereofJEZEWSKI CHRISTOPHER J·Filed 2012·Granted Dec 6, 2016·32 cites·19 claims
- 0293US9997457B2Cobalt based interconnects and methods of fabrication thereofINTEL CORP·Filed 2013·Granted Jun 12, 2018·12 cites·18 claims
- 0392US9691657B2Interconnect wires including relatively low resistivity coresINTEL CORP·Filed 2016·Granted Jun 27, 2017·6 cites·9 claims
- 0492US7867891B2Dual metal interconnects for improved gap-fill, reliability, and reduced capacitanceINTEL CORP·Filed 2008·Granted Jan 11, 2011·21 cites·14 claims
- 0586US12266568B2Interconnect wires including relatively low resistivity coresINTEL CORP·Filed 2023·Granted Apr 1, 2025·0 cites·18 claims
- 0686US10700007B2Cobalt based interconnects and methods of fabrication thereofINTEL CORP·Filed 2018·Granted Jun 30, 2020·3 cites·22 claims
- 0785US12354956B2Cobalt based interconnects and methods of fabrication thereofTAHOE RES LTD·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 0884US10468298B2Decoupled via fillINTEL CORP·Filed 2019·Granted Nov 5, 2019·3 cites·20 claims
- 0982US11881432B2Interconnect wires including relatively low resistivity coresINTEL CORP·Filed 2022·Granted Jan 23, 2024·0 cites·20 claims
- 1082US2025201629A1Interconnect wires including relatively low resistivity coresINTEL CORP·Filed 2025·Application pending·0 cites
- 1181US10026649B2Decoupled via fillINTEL CORP·Filed 2014·Granted Jul 17, 2018·4 cites·20 claims
- 1278US11862563B2Cobalt based interconnects and methods of fabrication thereofTAHOE RES LTD·Filed 2022·Granted Jan 2, 2024·0 cites·22 claims
- 1377US10832951B2Interconnect wires including relatively low resistivity coresINTEL CORP·Filed 2017·Granted Nov 10, 2020·1 cites·11 claims
- 1477US10658586B2RRAM devices and their methods of fabricationINTEL CORP·Filed 2016·Granted May 19, 2020·4 cites·25 claims
- 1577US10068845B2Seam healing of metal interconnectsINTEL CORP·Filed 2014·Granted Sep 4, 2018·3 cites·16 claims
- 1674US11569126B2Interconnect wires including relatively low resistivity coresINTEL CORP·Filed 2020·Granted Jan 31, 2023·0 cites·21 claims
- 1773US2025372302A1Capacitors for a microelectronic device having increased density and related methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1872US11328993B2Cobalt based interconnects and methods of fabrication thereofINTEL CORP·Filed 2020·Granted May 10, 2022·0 cites·10 claims
- 1961US10903114B2Decoupled via fillINTEL CORP·Filed 2019·Granted Jan 26, 2021·0 cites·20 claims
- 2059US9659869B2Forming barrier walls, capping, or alloys /compounds within metal linesINTEL CORP·Filed 2012·Granted May 23, 2017·1 cites·13 claims
- 2159US9349636B2Interconnect wires including relatively low resistivity coresINTEL CORP·Filed 2013·Granted May 24, 2016·0 cites·12 claims
- 2257US10629525B2Seam healing of metal interconnectsINTEL CORP·Filed 2018·Granted Apr 21, 2020·0 cites·17 claims
- 2357US10211098B2Decoupled via fillINTEL CORP·Filed 2018·Granted Feb 19, 2019·0 cites·20 claims
- 2450US2023298951A1Test structures for a wafer, and associated devices, systems, and methodsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 2545US11094587B2Use of noble metals in the formation of conductive connectorsINTEL CORP·Filed 2015·Granted Aug 17, 2021·0 cites·7 claims
- 2643US10381556B2Spin transfer torque memory (STTM), methods of forming the same using a non-conformal insulator, and devices including the sameINTEL CORP·Filed 2015·Granted Aug 13, 2019·0 cites·9 claims
- 2739US2011079910A1Dual metal interconnects for improved gap-fill, reliability, and reduced capacitanceO'BRIEN KEVIN·Filed 2010·Application pending·0 cites
- 2837US2019115353A1Layer transferred ferroelectric memory devicesINTEL CORP·Filed 2016·Application pending·0 cites
- 2936US2010200991A1Dopant Enhanced InterconnectAKOLKAR ROHAN·Filed 2010·Application pending·0 cites
- 3035US10580975B2Spin transfer torque memory (STTM), methods of forming the same using volatile compound forming elements, and devices including the sameINTEL CORP·Filed 2015·Granted Mar 3, 2020·0 cites·9 claims
- 3132US2020066967A1Damascene-based approaches for fabricating a pedestal for a magnetic tunnel junction (mtj) device and the resulting structuresINTEL CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →