Inventor · disambiguated record
Teruyuki Ishihara
Also filed as: ISHIHARA TERUYUKI
26 granted patents·14 pending applications·99 citations·filing 2010–2019
95Inventor score
Top patents by PatentIndex Score
40 records- 0192US8735739B2Wiring board and method for manufacturing the sameISHIHARA TERUYUKI·Filed 2011·Granted May 27, 2014·14 cites·12 claims
- 0289US10256175B2Printed wiring board and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2017·Granted Apr 9, 2019·6 cites·20 claims
- 0389US9258897B2Wiring board and method for manufacturing the sameISHIHARA TERUYUKI·Filed 2012·Granted Feb 9, 2016·12 cites·20 claims
- 0487US10004143B2Printed wiring board and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2016·Granted Jun 19, 2018·6 cites·15 claims
- 0586US8383948B2Flex-rigid wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2010·Granted Feb 26, 2013·11 cites·18 claims
- 0684US10674604B2Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2016·Granted Jun 2, 2020·4 cites·20 claims
- 0784US9756735B2Method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2015·Granted Sep 5, 2017·4 cites·18 claims
- 0883US9370101B2Method for plug-in board replacement and method for manufacturing multi-piece boardIBIDEN CO LTD·Filed 2013·Granted Jun 14, 2016·5 cites·14 claims
- 0982US10249561B2Printed wiring board having embedded pads and method for manufacturing the sameIBIDEN CO LTD·Filed 2017·Granted Apr 2, 2019·4 cites·20 claims
- 1081US9603238B2Combined wiring boardIBIDEN CO LTD·Filed 2013·Granted Mar 21, 2017·5 cites·20 claims
- 1179US10271430B2Printed wiring board having support plate and method for manufacturing printed wiring board having support plateIBIDEN CO LTD·Filed 2017·Granted Apr 23, 2019·3 cites·14 claims
- 1279US9277650B2Combined wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Granted Mar 1, 2016·3 cites·14 claims
- 1379US9277655B2Combined wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Granted Mar 1, 2016·3 cites·15 claims
- 1478US9040837B2Wiring board and method for manufacturing the sameTAKAHASHI MICHIMASA·Filed 2012·Granted May 26, 2015·4 cites·24 claims
- 1575US10051736B2Printed wiring board and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2017·Granted Aug 14, 2018·2 cites·20 claims
- 1675US9066439B2Wiring board and method for manufacturing the sameSEGAWA HIROSHI·Filed 2012·Granted Jun 23, 2015·5 cites·27 claims
- 1773US9949372B2Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2017·Granted Apr 17, 2018·2 cites·16 claims
- 1873US9635765B2Combined wiring board and method for manufacturing combined wiring boardIBIDEN CO LTD·Filed 2014·Granted Apr 25, 2017·2 cites·16 claims
- 1973US9480173B2Flex-rigid wiring board and method for manufacturing flex-rigid wiring boardIBIDEN CO LTD·Filed 2014·Granted Oct 25, 2016·2 cites·20 claims
- 2068US10004145B2Combined wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Granted Jun 19, 2018·1 cites·20 claims
- 2166US10219374B2Printed wiring boardIBIDEN CO LTD·Filed 2017·Granted Feb 26, 2019·1 cites·20 claims
- 2257US2013305530A1Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2013·Application pending·0 cites
- 2356US9538663B2Combined wiring board and method for manufacturing combined wiring boardIBIDEN CO LTD·Filed 2013·Granted Jan 3, 2017·0 cites·21 claims
- 2455US10874018B2Printed wiring board having embedded pads and method for manufacturing the sameIBIDEN CO LTD·Filed 2019·Granted Dec 22, 2020·0 cites·20 claims
- 2552US9844151B2Method for manufacturing combined wiring boardIBIDEN CO LTD·Filed 2014·Granted Dec 12, 2017·0 cites·14 claims
- 2652US2015114690A1Flex-rigid wiring board and method for manufacturing flex-rigid wiring boardIBIDEN CO LTD·Filed 2014·Application pending·0 cites
- 2752US2019139877A1Printed wiring board and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2018·Application pending·0 cites
- 2851US9215811B2Method for manufacturing multi-piece substrate and multi-piece substrateTAKAHASHI MICHIMASA·Filed 2012·Granted Dec 15, 2015·0 cites·20 claims
- 2950US10477682B2Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2019·Granted Nov 12, 2019·0 cites·15 claims
- 3048US2018054888A1Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2017·Application pending·0 cites
- 3145US2015245474A1Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Application pending·0 cites
- 3244US2014131074A1Wiring substrate and method for manufacturing wiring substrateIBIDEN CO LTD·Filed 2013·Application pending·0 cites
- 3337US2018054891A1Printed wiring board and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2017·Application pending·0 cites
- 3437US2017263571A1Electronic component built-in substrate and method for manufacturing the sameIBIDEN CO LTD·Filed 2017·Application pending·0 cites
- 3536US2017064825A1Printed wiring board and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2016·Application pending·0 cites
- 3636US2015257269A1Combined wiring boardIBIDEN CO LTD·Filed 2015·Application pending·0 cites
- 3736US2017196096A1Printed wiring board and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2017·Application pending·0 cites
- 3835US2017053878A1Printed wiring board and semiconductor packageIBIDEN CO LTD·Filed 2016·Application pending·0 cites
- 3934US2015366102A1Electronic circuit apparatus and method for manufacturing electronic circuit apparatusIBIDEN CO LTD·Filed 2015·Application pending·0 cites
- 4034US2017033036A1Printed wiring board, semiconductor package, and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →