Inventor · disambiguated record
Tetsuyuki Itakura
Also filed as: ITAKURA TETSUYUKI
5 granted patents·7 pending applications·212 citations·filing 1999–2004
84Inventor score
Top patents by PatentIndex Score
12 records- 0194US6530968B2Chemical mechanical polishing slurryNEC ELECTRONICS CORP·Filed 2001·Granted Mar 11, 2003·109 cites·19 claims
- 0290US6585568B2Chemical mechanical polishing slurryNEC ELECTRONICS CORP·Filed 2001·Granted Jul 1, 2003·54 cites·8 claims
- 0373US6585786B2Slurry for chemical mechanical polishingNEC ELECTRONICS CORP·Filed 2001·Granted Jul 1, 2003·16 cites·18 claims
- 0469US6478834B2Slurry for chemical mechanical polishingNEC CORP·Filed 2001·Granted Nov 12, 2002·13 cites·17 claims
- 0566US6444132B1Free abrasive slurry compositionsTOKYO MAGNETIC PRINTING·Filed 1999·Granted Sep 3, 2002·20 cites·6 claims
- 0638US2004216389A1Chemical mechanical polishing slurryNEC ELECTRONICS CORP·Filed 2004·Application pending·0 cites
- 0738US2001006031A1Slurry for chemical mechanical polishingFiled 2000·Application pending·0 cites
- 0837US2004020135A1Slurry for polishing copper-based metalNEC ELECTRONICS CORP·Filed 2003·Application pending·0 cites
- 0934US2001006224A1Slurry for chemical mechanical polishingFiled 2000·Application pending·0 cites
- 1034US2001005009A1Slurry for chemical mechanical polishingFiled 2000·Application pending·0 cites
- 1133US2001018270A1Slurry for chemical mechanical polishingFiled 2000·Application pending·0 cites
- 1233US2001006225A1Slurry for chemical mechanical polishingFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →