Inventor · disambiguated record
Teppei Ito
Also filed as: ITO TEPPEI
12 granted patents·10 pending applications·20 citations·filing 2007–2025
86Inventor score
Top patents by PatentIndex Score
22 records- 0175US9415709B2Seat for vehicleTS TECH CO LTD·Filed 2013·Granted Aug 16, 2016·7 cites·12 claims
- 0273US11904747B2Support and cushion for a vehicle seatTS TECH CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·6 claims
- 0372US10086727B1Vehicle seatTS TECH CO LTD·Filed 2017·Granted Oct 2, 2018·3 cites·11 claims
- 0471US2025388048A1Wheel for vehicleTOYOTA MOTOR CO LTD·Filed 2025·Application pending·0 cites
- 0566US11529897B2Vehicle seatTS TECH CO LTD·Filed 2020·Granted Dec 20, 2022·0 cites·10 claims
- 0664US8871660B2Laminated body, circuit board including laminated body, semiconductor package and process for manufacturing laminated bodyYOSHIZAKI KAZUYUKI·Filed 2008·Granted Oct 28, 2014·3 cites·19 claims
- 0759US11117500B2Vehicle seatTS TECH CO LTD·Filed 2019·Granted Sep 14, 2021·1 cites·20 claims
- 0857US9126503B2Stowable rear seatITO TEPPEI·Filed 2011·Granted Sep 8, 2015·4 cites·10 claims
- 0953US10864834B2Vehicle seatTS TECH CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·8 claims
- 1053US9738193B2Vehicle seatTS TECH CO LTD·Filed 2013·Granted Aug 22, 2017·1 cites·19 claims
- 1148US10399471B2Vehicle seat with pad having a through-opening for harnessTS TECH CO LTD·Filed 2017·Granted Sep 3, 2019·0 cites·20 claims
- 1248US2010258938A1Substrate and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2007·Application pending·0 cites
- 1345US10023082B2Seat for vehicleTS TECH CO LTD·Filed 2016·Granted Jul 17, 2018·0 cites·7 claims
- 1445US8783753B2Stowable rear seatITO TEPPEI·Filed 2011·Granted Jul 22, 2014·1 cites·20 claims
- 1544US2011120760A1Electroless copper plating method, printed wiring board, method for producing the same, and semiconductor deviceOKADA RYOICHI·Filed 2009·Application pending·0 cites
- 1643US2022160590A1Dental addition silicone compositionG C DENTAL IND CORP·Filed 2020·Application pending·0 cites
- 1740US2008036097A1Semiconductor package, method of production thereof and encapsulation resinITO TEPPEI·Filed 2007·Application pending·0 cites
- 1838US2015083872A1Seat mounting structureTS TECH CO LTD·Filed 2013·Application pending·0 cites
- 1938US2015291072A1Vehicle seatTS TECH CO LTD·Filed 2013·Application pending·0 cites
- 2035US2013058062A1Method for manufacturing base material having gold-plated metal fine pattern, base material having gold-plated metal fine pattern, printed wiring board, interposer, and semiconductor deviceTACHIBANA KENYA·Filed 2011·Application pending·0 cites
- 2133US2011051387A1Method for electroless nickel-palladium-gold plating, plated product, printed wiring board, interposer and semiconductor apparatusSUMITOMO BAKELITE CO·Filed 2010·Application pending·0 cites
- 2232US2017028880A1Tether anchor bracketTS TECH CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →