Inventor · disambiguated record
Teahwa Jeong
Also filed as: JEONG TEAHWA
5 granted patents·2 pending applications·4 citations·filing 2019–2023
64Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD7
Top patents by PatentIndex Score
7 records- 0193US11742271B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 29, 2023·4 cites·20 claims
- 0271US12476180B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 0364US11637058B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 25, 2023·0 cites·19 claims
- 0453US2024088094A1Semiconductor package and system including semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0550US2023038603A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0648US11444014B2Semiconductor packages including an insulating layer including a recessed surface and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 13, 2022·0 cites·18 claims
- 0745US10872869B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 22, 2020·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →