Inventor · disambiguated record
Tee-Eu Jin
Also filed as: JIN TEE-EU
2 granted patents·4 citations·filing 2007–2010
46Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0163US7759171B2Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor packageSPANSION LLC·Filed 2007·Granted Jul 20, 2010·4 cites·14 claims
- 0233US8546936B2Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor packageHUSSIN PAKHORUDIN·Filed 2010·Granted Oct 1, 2013·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →