Inventor · disambiguated record
Telesphor Kamgaing
Also filed as: KAMGAING TELESPHOR
190 granted patents·95 pending applications·856 citations·filing 2005–2025
99Inventor score
Top patents by PatentIndex Score
285 records- 0199US7548138B2Compact integration of LC resonatorsINTEL CORP·Filed 2005·Granted Jun 16, 2009·107 cites·23 claims
- 0298US9413079B2Single-package phased array module with interleaved sub-arraysINTEL CORP·Filed 2013·Granted Aug 9, 2016·65 cites·24 claims
- 0397US11387200B2Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabricINTEL CORP·Filed 2020·Granted Jul 12, 2022·4 cites·20 claims
- 0497US10615133B2Die package with superposer substrate for passive componentsINTEL CORP·Filed 2013·Granted Apr 7, 2020·22 cites·17 claims
- 0596US9960849B1Channelization for dispersion limited waveguide communication channelsINTEL CORP·Filed 2016·Granted May 1, 2018·17 cites·19 claims
- 0696US8582333B2Integration of switched capacitor networks for power deliveryORAW BRADLEY S·Filed 2008·Granted Nov 12, 2013·76 cites·11 claims
- 0795US10658312B2Embedded millimeter-wave phased array moduleINTEL CORP·Filed 2017·Granted May 19, 2020·11 cites·13 claims
- 0895US10128177B2Multi-layer package with integrated antennaINTEL CORP·Filed 2014·Granted Nov 13, 2018·43 cites·15 claims
- 0995US8330436B2Series and parallel hybrid switched capacitor networks for IC power deliveryORAW BRADLEY S·Filed 2008·Granted Dec 11, 2012·55 cites·21 claims
- 1094US11050155B2Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systemsINTEL CORP·Filed 2016·Granted Jun 29, 2021·7 cites·20 claims
- 1194US10886606B2Microelectronic devices designed with flexible package substrates with distributed stacked antennas for high frequency communication systemsINTEL CORP·Filed 2016·Granted Jan 5, 2021·11 cites·20 claims
- 1294US8759950B2Radio- and electromagnetic interference through-silicon vias for stacked-die packages, and methods of making sameKAMGAING TELESPHOR·Filed 2011·Granted Jun 24, 2014·22 cites·11 claims
- 1393US11562971B2Semiconductor packages with antennasINTEL CORP·Filed 2020·Granted Jan 24, 2023·2 cites·15 claims
- 1493US10951248B1Radio frequency (RF) module with shared inductorINTEL CORP·Filed 2019·Granted Mar 16, 2021·9 cites·10 claims
- 1593US9773742B2Embedded millimeter-wave phased array moduleINTEL CORP·Filed 2013·Granted Sep 26, 2017·15 cites·15 claims
- 1693US9318952B2Series and parallel hybrid switched capacitor networks for IC power deliveryINTEL CORP·Filed 2014·Granted Apr 19, 2016·10 cites·15 claims
- 1792US11476554B2Mmwave waveguide to waveguide connectors for automotive applicationsINTEL CORP·Filed 2017·Granted Oct 18, 2022·9 cites·25 claims
- 1892US11206008B2Hybrid filter architecture with integrated passives, acoustic wave resonators and hermetically sealed cavities between two resonator diesINTEL CORP·Filed 2017·Granted Dec 21, 2021·7 cites·25 claims
- 1992US10573608B2Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on packageINTEL CORP·Filed 2015·Granted Feb 25, 2020·9 cites·22 claims
- 2092US10439671B2Microelectronic devices designed with high frequency communication modules having steerable beamforming capabilityINTEL CORP·Filed 2015·Granted Oct 8, 2019·10 cites·20 claims
- 2192US10291283B2Tunable radio frequency systems using piezoelectric package-integrated switching devicesINTEL CORP·Filed 2016·Granted May 14, 2019·6 cites·22 claims
- 2292US10079668B2Waveguide communication with increased link data rateINTEL CORP·Filed 2016·Granted Sep 18, 2018·8 cites·24 claims
- 2391US10804227B2Semiconductor packages with antennasINTEL CORP·Filed 2016·Granted Oct 13, 2020·5 cites·18 claims
- 2491US8816906B2Chip packages including through-silicon via dice with vertically inegrated phased-array antennas and low-frequency and power delivery substratesKAMGAING TELESPHOR·Filed 2011·Granted Aug 26, 2014·14 cites·27 claims
- 2591US7626472B2Package embedded three dimensional balunINTEL CORP·Filed 2007·Granted Dec 1, 2009·28 cites·14 claims
- 2690US10452571B2Microelectronic package communication using radio interfaces connected through waveguidesINTEL CORP·Filed 2015·Granted Oct 22, 2019·8 cites·16 claims
- 2790US2025316619A1Semiconductor packages with antennasINTEL CORP·Filed 2025·Application pending·0 cites
- 2889US11316497B2Multi-filter dieINTEL CORP·Filed 2019·Granted Apr 26, 2022·4 cites·20 claims
- 2989US10887439B2Microelectronic devices designed with integrated antennas on a substrateINTEL CORP·Filed 2015·Granted Jan 5, 2021·5 cites·18 claims
- 3089US10410983B2Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on an inter die fabric on packageINTEL CORP·Filed 2015·Granted Sep 10, 2019·6 cites·20 claims
- 3189US9921640B2Integrated voltage regulators with magnetically enhanced inductorsINTEL CORP·Filed 2012·Granted Mar 20, 2018·12 cites·24 claims
- 3288US10629551B2Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabricINTEL CORP·Filed 2015·Granted Apr 21, 2020·5 cites·19 claims
- 3388US9786581B2Through-silicon via (TSV)-based devices and associated techniques and configurationsINTEL CORP·Filed 2014·Granted Oct 10, 2017·9 cites·20 claims
- 3488US7760140B2Multiband antenna array using electromagnetic bandgap structuresINTEL CORP·Filed 2006·Granted Jul 20, 2010·20 cites·19 claims
- 3587US12400934B2Dielectric film coating for through glass vias and plane surface roughness mitigationINTEL CORP·Filed 2021·Granted Aug 26, 2025·1 cites·17 claims
- 3687US11056765B2Microelectronic devices designed with foldable flexible substrates for high frequency communication modulesINTEL CORP·Filed 2016·Granted Jul 6, 2021·5 cites·17 claims
- 3787US9229466B2Fully integrated voltage regulators for multi-stack integrated circuit architecturesSARASWAT RUCHIR·Filed 2011·Granted Jan 5, 2016·11 cites·25 claims
- 3887US8901688B2High performance glass-based 60 ghz / mm-wave phased array antennas and methods of making sameKAMGAING TELESPHOR·Filed 2011·Granted Dec 2, 2014·9 cites·26 claims
- 3986US12362297B2Semiconductor packages with antennasINTEL CORP·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 4086US10546835B2Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabricINTEL CORP·Filed 2015·Granted Jan 28, 2020·4 cites·16 claims
- 4186US9647636B1Piezoelectric package-integrated delay lines for radio frequency identification tagsINTEL CORP·Filed 2016·Granted May 9, 2017·4 cites·26 claims
- 4285US12327794B2Die coupling using a substrate with a glass coreINTEL CORP·Filed 2021·Granted Jun 10, 2025·1 cites·17 claims
- 4385US11456721B2RF front end module including hybrid filter and active circuits in a single packageINTEL CORP·Filed 2017·Granted Sep 27, 2022·4 cites·28 claims
- 4485US11310907B2Microelectronic package with substrate-integrated componentsINTEL CORP·Filed 2019·Granted Apr 19, 2022·3 cites·13 claims
- 4585US10327268B2Microelectronic package with wireless interconnectINTEL CORP·Filed 2015·Granted Jun 18, 2019·3 cites·18 claims
- 4685US9659904B2Distributed on-package millimeter-wave radioINTEL CORP·Filed 2013·Granted May 23, 2017·5 cites·11 claims
- 4785US9166284B2Package structures including discrete antennas assembled on a deviceINTEL CORP·Filed 2012·Granted Oct 20, 2015·6 cites·46 claims
- 4885US8710903B2Drive and startup for a switched capacitor dividerORAW BRADLEY·Filed 2008·Granted Apr 29, 2014·25 cites·20 claims
- 4985US2024266745A1Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systemsINTEL CORP·Filed 2024·Application pending·0 cites
- 5084US12412835B2Back-side power delivery with glass support at the frontINTEL CORP·Filed 2021·Granted Sep 9, 2025·1 cites·20 claims
Showing the top 50 of 285 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →