Inventor · disambiguated record
Tetsuaki Kamiya
Also filed as: KAMIYA TETSUAKI
4 granted patents·1 pending application·88 citations·filing 1994–2005
79Inventor score
Top patents by PatentIndex Score
5 records- 0174US6667443B2Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing methodDENSO CORP·Filed 2001·Granted Dec 23, 2003·18 cites·13 claims
- 0272US5525831ASemiconductor device with thin film resistor having reduced film thickness sensitivity during trimming processNIPPON DENSO CO·Filed 1994·Granted Jun 11, 1996·33 cites·18 claims
- 0366US6242792B1Semiconductor device having oblique portion as reflectionDENSO CORP·Filed 1999·Granted Jun 5, 2001·31 cites·36 claims
- 0457US6855625B2Manufacturing method of multilayer substrateDENSO CORP·Filed 2003·Granted Feb 15, 2005·6 cites·27 claims
- 0544US2005230370A1Laser beam machining equipment and method for machining by using laser beamDENSO CORP·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →