Inventor · disambiguated record
Te-Ming Kung
Also filed as: KUNG TE-MING
13 granted patents·5 pending applications·17 citations·filing 2014–2025
86Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD10ASMEDIA TECH INC3TAIWAN SEMICONDUCTOR MFG2TU CHANG YU2COMPAL ELECTRONICS INC1
Top patents by PatentIndex Score
18 records- 0196US11397078B2Thin film metrologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 26, 2022·4 cites·20 claims
- 0295US11761751B2Thin film metrologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 19, 2023·2 cites·20 claims
- 0387US9368394B1Dry etching gas and method of manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 14, 2016·6 cites·20 claims
- 0487US2025366098A1Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0584US12464790B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 4, 2025·0 cites·20 claims
- 0683US9281475B2Resistive random-access memory (RRAM) with multi-layer device structureTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 8, 2016·4 cites·20 claims
- 0778US12224179B2Metal heterojunction structure with capping metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 11, 2025·0 cites·20 claims
- 0878US12158332B2Thin film metrologyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 3, 2024·0 cites·20 claims
- 0973US12021117B2Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 25, 2024·0 cites·20 claims
- 1071US11637021B2Metal heterojunction structure with capping metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 25, 2023·0 cites·20 claims
- 1165US9502647B2Resistive random-access memory (RRAM) with a low-K porous layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 22, 2016·1 cites·10 claims
- 1263US12276698B2Testing system and testing methodASMEDIA TECH INC·Filed 2023·Granted Apr 15, 2025·0 cites·9 claims
- 1360US12181536B2Testing circuit for testing universal serial busASMEDIA TECH INC·Filed 2023·Granted Dec 31, 2024·0 cites·10 claims
- 1460US11037799B2Metal heterojunction structure with capping metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 15, 2021·0 cites·20 claims
- 1550US2025363069A1Usb circuit and operating method thereof and usb deviceASMEDIA TECH INC·Filed 2024·Application pending·0 cites
- 1628US2020341926A1Electronic apparatus installed with non-volatile memory express solid state diskTU CHANG YU·Filed 2019·Application pending·0 cites
- 1726US2017168964A1Hard drive disk indicator processing apparatusCOMPAL ELECTRONICS INC·Filed 2016·Application pending·0 cites
- 1823US2018156552A1Thermal simulation systemTU CHANG YU·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →