Inventor · disambiguated record
Teppei Kunimune
Also filed as: KUNIMUNE TEPPEI
11 granted patents·1 pending application·4 citations·filing 2011–2023
81Inventor score
Top patents by PatentIndex Score
12 records- 0181US10941304B2Metal powder sintering paste and method of producing the same, and method of producing conductive materialNICHIA CORP·Filed 2017·Granted Mar 9, 2021·3 cites·25 claims
- 0280US12447528B2Resin impregnation method, method of manufacturing wavelength-conversion module, and wavelength-conversion moduleNICHIA CORP·Filed 2023·Granted Oct 21, 2025·0 cites·9 claims
- 0379US11739238B2Electrically conductive adhesive and electrically conductive materialNICHIA CORP·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 0475US12125607B2Metal powder sintering paste and method of producing the same, and method of producing conductive materialNICHIA CORP·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 0572US11752551B2Resin impregnation method, method of manufacturing wavelength-conversion module, and wavelength-conversion moduleNICHIA CORP·Filed 2021·Granted Sep 12, 2023·0 cites·13 claims
- 0667US11634596B2Metal powder sintering paste and method of producing the same, and method of producing conductive materialNICHIA CORP·Filed 2021·Granted Apr 25, 2023·0 cites·9 claims
- 0767US11162004B2Electrically conductive adhesive and electrically conductive materialNICHIA CORP·Filed 2017·Granted Nov 2, 2021·0 cites·18 claims
- 0858US10593851B2Metal powder sintering paste, method for producing the same, and method for producing conductive materialNICHIA CORP·Filed 2018·Granted Mar 17, 2020·0 cites·19 claims
- 0958US8836130B2Light emitting semiconductor element bonded to a base by a silver coatingKURAMOTO MASAFUMI·Filed 2011·Granted Sep 16, 2014·1 cites·10 claims
- 1049US10707388B2Semiconductor device, and method for manufacturing semiconductor deviceNICHIA CORP·Filed 2018·Granted Jul 7, 2020·0 cites·19 claims
- 1147US2023041361A1Wavelength conversion moduleNICHIA CORP·Filed 2022·Application pending·0 cites
- 1242US10875127B2Method for bonding electronic component and method for manufacturing bonded bodyNICHIA CORP·Filed 2018·Granted Dec 29, 2020·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →