Inventor · disambiguated record
Teppei Kurokawa
Also filed as: KUROKAWA TEPPEI
14 granted patents·3 pending applications·8 citations·filing 2010–2023
85Inventor score
Top patents by PatentIndex Score
17 records- 0187US10748678B2Substrate for superconducting wire, production method therefor, and superconducting wireTOYO KOHAN CO LTD·Filed 2015·Granted Aug 18, 2020·3 cites·10 claims
- 0284US11453203B2Roll-bonded laminate and method for producing the sameTOYO KOHAN CO LTD·Filed 2018·Granted Sep 27, 2022·2 cites·11 claims
- 0382US12070923B2Substrate for epitaxial growth and method for producing sameTOYO KOHAN CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·4 claims
- 0475US10864596B2Metal laminate material and production method thereforTOYO KOHAN CO LTD·Filed 2016·Granted Dec 15, 2020·1 cites·7 claims
- 0572US8815777B2Metal laminated substrate for use as an oxide superconducting wire material, and manufacturing method thereforOKAYAMA HIRONAO·Filed 2010·Granted Aug 26, 2014·2 cites·3 claims
- 0664US11524486B2Substrate for epitaxtail, growth and method for producing sameTOYO KOHAN CO LTD·Filed 2016·Granted Dec 13, 2022·0 cites·3 claims
- 0763US10174420B2Method for forming oxide layer, laminated substrate for epitaxial growth, and method for producing the sameTOYO KOHAN CO LTD·Filed 2014·Granted Jan 8, 2019·0 cites·12 claims
- 0860US11590603B2Roll-bonded body and method for producing sameTOYO KOHAN CO LTD·Filed 2018·Granted Feb 28, 2023·0 cites·13 claims
- 0960US10087552B2Substrate for epitaxial growth, manufacturing method therefor, and substrate for superconducting wireTOYO KOHAN CO LTD·Filed 2013·Granted Oct 2, 2018·0 cites·6 claims
- 1058US10115501B2Substrate for superconducting wire, method for manufacturing the same, and superconducting wireTOYO KOHAN CO LTD·Filed 2014·Granted Oct 30, 2018·0 cites·5 claims
- 1156US11878363B2Roll-bonded body and method for producing roll-bonded bodyTOYO KOHAN CO LTD·Filed 2019·Granted Jan 23, 2024·0 cites·8 claims
- 1256US11840045B2Roll-bonded laminateTOYO KOHAN CO LTD·Filed 2018·Granted Dec 12, 2023·0 cites·3 claims
- 1355US2025196472A1Roll-bonded laminate and method for producing the sameTOYO KOHAN CO LTD·Filed 2023·Application pending·0 cites
- 1454US11407202B2Roll-bonded laminate, method for producing the same, and heat radiation reinforcement member for electronic equipmentTOYO KOHAN CO LTD·Filed 2019·Granted Aug 9, 2022·0 cites·10 claims
- 1549US10259073B2Method for producing metal laminate materialTOYO KOHAN CO LTD·Filed 2015·Granted Apr 16, 2019·0 cites·8 claims
- 1644US2021114347A1Roll-bonded laminate for electronic device and electronic device housingTOYO KOHAN CO LTD·Filed 2018·Application pending·0 cites
- 1738US2017014942A1Method for producing metal laminate materialTOYO KOHAN CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →