Inventor · disambiguated record
Tetsuharu Kurokawa
Also filed as: KUROKAWA TETSUHARU
3 granted patents·0 citations·filing 2018–2021
44Inventor score
Technology areasH10P
Files withWINBOND ELECTRONICS CORP3
Top patents by PatentIndex Score
3 records- 0164US11610897B2Landing pad structureWINBOND ELECTRONICS CORP·Filed 2021·Granted Mar 21, 2023·0 cites·10 claims
- 0255US11011525B2Landing pad structure and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted May 18, 2021·0 cites·7 claims
- 0337US10985262B2Semiconductor structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2018·Granted Apr 20, 2021·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →