Inventor · disambiguated record
Teck Kheng Lee
Also filed as: LEE TECK K · LEE TECK KHENG
68 granted patents·5 pending applications·1,404 citations·filing 2001–2020
99Inventor score
Files withMICRON TECHNOLOGY INC58LEE TECK KHENG12INST OF TECHNICAL EDUCATION1INVIVO MEDICAL PTE LTD1
Top patents by PatentIndex Score
73 records- 0197US7531906B2Flip chip packaging using recessed interposer terminalsMICRON TECHNOLOGY INC·Filed 2006·Granted May 12, 2009·53 cites·24 claims
- 0297US7189593B2Elimination of RDL using tape base flip chip on flex for die stackingMICRON TECHNOLOGY INC·Filed 2004·Granted Mar 13, 2007·83 cites·48 claims
- 0396US8669173B2Methods of fluxless micro-piercing of solder balls, and resulting devicesMICRON TECHNOLOGY INC·Filed 2013·Granted Mar 11, 2014·15 cites·20 claims
- 0496US6583502B2Apparatus for package reduction in stacked chip and board assembliesMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 24, 2003·110 cites·29 claims
- 0595US7553699B2Method of fabricating microelectronic devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Jun 30, 2009·29 cites·29 claims
- 0694US7902648B2Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methodsMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 8, 2011·27 cites·46 claims
- 0794US7612436B1Packaged microelectronic devices with a lead frameMICRON TECHNOLOGY INC·Filed 2008·Granted Nov 3, 2009·81 cites·14 claims
- 0894US7129584B2Elimination of RDL using tape base flip chip on flex for die stackingMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 31, 2006·44 cites·142 claims
- 0993US7749887B2Methods of fluxless micro-piercing of solder balls, and resulting devicesMICRON TECHNOLOGY INC·Filed 2007·Granted Jul 6, 2010·17 cites·9 claims
- 1093US6762503B2Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing sameMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 13, 2004·65 cites·57 claims
- 1193US6720666B2BOC BGA package for die with I-shaped bond pad layoutMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 13, 2004·91 cites·53 claims
- 1292US7397129B2Interposers with flexible solder pad elementsMICRON TECHNOLOGY INC·Filed 2006·Granted Jul 8, 2008·18 cites·12 claims
- 1392US7112520B2Semiconductor die packages with recessed interconnecting structures and methods for assembling the sameMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 26, 2006·60 cites·53 claims
- 1492US6975035B2Method and apparatus for dielectric filling of flip chip on interposer assemblyMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 13, 2005·61 cites·75 claims
- 1592US6756251B2Method of manufacturing microelectronic devices, including methods of underfilling microelectronic components through an underfill apertureMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 29, 2004·56 cites·43 claims
- 1691US8125065B2Elimination of RDL using tape base flip chip on flex for die stackingLEE TECK KHENG·Filed 2007·Granted Feb 28, 2012·16 cites·33 claims
- 1790US7622377B2Microfeature workpiece substrates having through-substrate vias, and associated methods of formationMICRON TECHNOLOGY INC·Filed 2005·Granted Nov 24, 2009·25 cites·34 claims
- 1890US7161237B2Flip chip packaging using recessed interposer terminalsMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 9, 2007·49 cites·23 claims
- 1989US6787917B2Apparatus for package reduction in stacked chip and board assembliesMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 7, 2004·45 cites·20 claims
- 2088US7422978B2Methods of manufacturing interposers with flexible solder pad elementsMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 9, 2008·11 cites·31 claims
- 2188US6692987B2BOC BGA package for die with I-shaped bond pad layoutMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 17, 2004·60 cites·74 claims
- 2287US7830018B2Partitioned through-layer via and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2007·Granted Nov 9, 2010·12 cites·16 claims
- 2387US7663206B2Interposer including at least one passive element at least partially defined by a recess formed therein, system including same, and wafer-scale interposerMICRON TECHNOLOGY INC·Filed 2006·Granted Feb 16, 2010·12 cites·37 claims
- 2486US8441113B2Elimination of RDL using tape base flip chip on flex for die stackingLEE TECK KHENG·Filed 2012·Granted May 14, 2013·6 cites·18 claims
- 2586US6940179B2Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing sameMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 6, 2005·36 cites·13 claims
- 2685US8269326B2Semiconductor device assembliesLEE TECK KHENG·Filed 2011·Granted Sep 18, 2012·6 cites·20 claims
- 2785US7348215B2Methods for assembly and packaging of flip chip configured dice with interposerMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 25, 2008·25 cites·36 claims
- 2885US7145225B2Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methodsMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 5, 2006·31 cites·36 claims
- 2984US10163840B2Methods of fluxless micro-piercing of solder balls, and resulting devicesMICRON TECHNOLOGY INC·Filed 2014·Granted Dec 25, 2018·4 cites·7 claims
- 3084US7138711B2Intrinsic thermal enhancement for FBGA packageMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 21, 2006·31 cites·28 claims
- 3181US8367538B2Partitioned through-layer via and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2010·Granted Feb 5, 2013·4 cites·14 claims
- 3281US7915718B2Apparatus for flip-chip packaging providing testing capabilityMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 29, 2011·29 cites·32 claims
- 3381US7459346B2Intrinsic thermal enhancement for FBGA packageMICRON TECHNOLOGY INC·Filed 2005·Granted Dec 2, 2008·8 cites·27 claims
- 3480US7005316B2Method for package reduction in stacked chip and board assembliesMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 28, 2006·23 cites·16 claims
- 3578US7230330B2Semiconductor die packages with recessed interconnecting structuresMICRON TECHNOLOGY INC·Filed 2004·Granted Jun 12, 2007·20 cites·38 claims
- 3678US7105918B2Interposer with flexible solder pad elements and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 12, 2006·15 cites·13 claims
- 3777US8174101B2Microelectronic devices and microelectronic support devices, and associated assemblies and methodsLEE TECK KHENG·Filed 2005·Granted May 8, 2012·7 cites·18 claims
- 3877US7087460B2Methods for assembly and packaging of flip chip configured dice with interposerMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 8, 2006·15 cites·25 claims
- 3976US7521794B2Intrinsic thermal enhancement for FBGA packageMICRON TECHNOLOGY INC·Filed 2006·Granted Apr 21, 2009·5 cites·31 claims
- 4075US7122907B2Interposer substrate and wafer scale interposer substrate member for use with flip-chip configured semiconductor diceMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 17, 2006·17 cites·26 claims
- 4175US7087994B2Microelectronic devices including underfill aperturesMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 8, 2006·16 cites·13 claims
- 4273US7320933B2Double bumping of flexible substrate for first and second level interconnectsMICRON TECHNOLOGY INC·Filed 2004·Granted Jan 22, 2008·15 cites·19 claims
- 4372US8604598B2Microelectronic devices and methods for manufacturing microelectronic devicesLEE TECK KHENG·Filed 2012·Granted Dec 10, 2013·2 cites·20 claims
- 4467US7534660B2Methods for assembly and packaging of flip chip configured dice with interposerMICRON TECHNOLOGY INC·Filed 2004·Granted May 19, 2009·9 cites·13 claims
- 4566US8101464B2Microelectronic devices and methods for manufacturing microelectronic devicesLEE TECK KHENG·Filed 2006·Granted Jan 24, 2012·2 cites·21 claims
- 4665US8742572B2Microelectronic devices and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2012·Granted Jun 3, 2014·1 cites·20 claims
- 4765US7569473B2Methods of forming semiconductor assembliesMICRON TECHNOLOGY INC·Filed 2007·Granted Aug 4, 2009·2 cites·16 claims
- 4864US7354795B2Methods for packaging and encapsulating semiconductor device assemblies that include tape substratesMICRON TECHNOLOGY INC·Filed 2007·Granted Apr 8, 2008·2 cites·18 claims
- 4964US7183134B2Ultrathin leadframe BGA circuit packageMICRON TECHNOLOGY INC·Filed 2004·Granted Feb 27, 2007·10 cites·26 claims
- 5063US7968376B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2009·Granted Jun 28, 2011·2 cites·16 claims
Showing the top 50 of 73 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →