Inventor · disambiguated record
Terrence Evan Lewis
Also filed as: LEWIS TERRENCE E · LEWIS TERRENCE EVAN
6 granted patents·196 citations·filing 1975–2000
85Inventor score
Top patents by PatentIndex Score
6 records- 0190US4611238AIntegrated circuit package incorporating low-stress omnidirectional heat sinkBURROUGHS CORP·Filed 1985·Granted Sep 9, 1986·124 cites·11 claims
- 0263US6247939B1Connector for making multiple pressed co-axial connections having an air dielectricUNISYS CORP·Filed 2000·Granted Jun 19, 2001·16 cites·11 claims
- 0359US3999285ASemiconductor device packageBURROUGHS CORP·Filed 1975·Granted Dec 28, 1976·22 cites·3 claims
- 0457US4139859ASemiconductor device packageBURROUGHS CORP·Filed 1976·Granted Feb 13, 1979·20 cites·5 claims
- 0551US6336815B1Connector for sending power to an IC-chip thru two pressed joints in seriesUNISYS CORP·Filed 2000·Granted Jan 8, 2002·10 cites·10 claims
- 0637US6302703B1Connector for sending power to an IC-chip thru four pressed joints in seriesUNISYS CORP·Filed 2000·Granted Oct 16, 2001·4 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →