Inventor · disambiguated record
Tetsuro Maeda
Also filed as: MAEDA TETSURO
16 granted patents·3 pending applications·215 citations·filing 1982–2008
94Inventor score
Top patents by PatentIndex Score
19 records- 0185USD418156SToner cartridgeFUJI XEROX CO LTD·Filed 1998·Granted Dec 28, 1999·29 cites·1 claims
- 0272US4774291APolymer compositionDENKI KAGAKU KOGYO KK·Filed 1986·Granted Sep 27, 1988·20 cites·9 claims
- 0370US4461865AABS Resin compositionDENKI KAGAKU KOGYO KK·Filed 1982·Granted Jul 24, 1984·19 cites·9 claims
- 0461US5909976ABrush-equipped container for cyanoacrylate adhesiveTHREE BOND CO LTD·Filed 1998·Granted Jun 8, 1999·23 cites·14 claims
- 0561USD408444SImage forming apparatusFUJI XEROX CO LTD·Filed 1998·Granted Apr 20, 1999·11 cites·1 claims
- 0661US4740553AMolding composition containing an elastomer-containing styrene resin, a polycarbonate resin, and a polymer of an acrylate monomer possessing environmental stress cracking resistanceDENKI KAGAKU KOGYO KK·Filed 1986·Granted Apr 26, 1988·15 cites·24 claims
- 0758US6137975ADeveloping device for preventing an overflow of a developer from a developing unitFUJI XEROX CO LTD·Filed 1999·Granted Oct 24, 2000·13 cites·19 claims
- 0858US6104898ARotary developing device having adjustably mounted developing unitsFUJI XEROX CO LTD·Filed 1999·Granted Aug 15, 2000·13 cites·11 claims
- 0953US4812516APolymer compositionDENKI KAGAKU KOGYO KK·Filed 1988·Granted Mar 14, 1989·10 cites·13 claims
- 1048US4965315AThermoplastic resin compositionDENKI KAGAKU KOGYO KK·Filed 1985·Granted Oct 23, 1990·7 cites·9 claims
- 1145US2011272731A1Substrate for light emitting element package, and light emitting element packageDENKI KAGAKU KOGYO KK·Filed 2008·Application pending·0 cites
- 1244US6459699B1ATM switching module which allows system growth with different type of module without cell-loss during cutoverNEC CORP·Filed 1999·Granted Oct 1, 2002·22 cites·7 claims
- 1343US4533698AThermoplastic resin compositionDENKI KAGAKU KOGYO KK·Filed 1983·Granted Aug 6, 1985·9 cites·10 claims
- 1441US4732807APlated resin articleDENKI KAGAKU KOGYO KK·Filed 1985·Granted Mar 22, 1988·6 cites·5 claims
- 1540US2011284914A1Method for manufacturing substrate for light emitting element package, and light emitting element packageSUZUKI MOTOHIRO·Filed 2008·Application pending·0 cites
- 1640US2011311831A1Method for manufacturing substrate for light emitting element package, and light emitting element packageSUZUKI MOTOHIRO·Filed 2008·Application pending·0 cites
- 1739US4476266AThermoplastic resin compositionsDENKI KAGAKU KOGYO KK·Filed 1982·Granted Oct 9, 1984·9 cites·19 claims
- 1837US4876145APlated resin articleDENKI KAGAKU KOGYO KK·Filed 1987·Granted Oct 24, 1989·8 cites·2 claims
- 1924US4612253AResin composition and plated article thereofDENKI KAGAKU KOGYO KK·Filed 1985·Granted Sep 16, 1986·1 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →