Inventor · disambiguated record
Tetsuhiro Matsunaga
Also filed as: MATSUNAGA TETSUHIRO
7 granted patents·1 pending application·18 citations·filing 2003–2012
78Inventor score
Top patents by PatentIndex Score
8 records- 0183US8497026B2Porous metal foil and production method thereforMATSUNAGA TETSUHIRO·Filed 2010·Granted Jul 30, 2013·3 cites·20 claims
- 0269US8304091B2Electrodeposited copper foil with carrier foil with a primer resin layer and manufacturing method thereofMATSUNAGA TETSUHIRO·Filed 2005·Granted Nov 6, 2012·1 cites·20 claims
- 0368US9595719B2Composite metal foil and production method thereforMATSUNAGA TETSUHIRO·Filed 2012·Granted Mar 14, 2017·1 cites·18 claims
- 0466US8187723B2Surface-treated copper foil, manufacturing method of the surface-treated copper foil, and surface-treated copper foil coated with very thin primer resin layerMATSUNAGA TETSUHIRO·Filed 2006·Granted May 29, 2012·4 cites·9 claims
- 0560US7524552B2Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such copper foil with dielectric layer, and method for manufacturing producing such copper foil with dielectric layer for formation of capacitor layerMITSUI MINING & SMELTING CO·Filed 2003·Granted Apr 28, 2009·8 cites·29 claims
- 0655US9512527B2Reinforced porous metal foil and process for production thereofMATSUNAGA TETSUHIRO·Filed 2012·Granted Dec 6, 2016·1 cites·14 claims
- 0754US2010068511A1Surface-treated copper foil, surface-treated copper foil with very thin primer resin layer, method for manufacturing the surface-treated copper foil, and method for manufacturing the surface-treated copper foil with very thin primer resin layerMITSUI MINING & SMELTING CO·Filed 2007·Application pending·0 cites
- 0847US8980438B2Porous metal foil and production method thereforMATSUNAGA TETSUHIRO·Filed 2012·Granted Mar 17, 2015·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →