Inventor · disambiguated record
Teruo Murase
Also filed as: MURAKAWA KYOHEI · MURASE TERUO
11 granted patents·791 citations·filing 1978–2000
93Inventor score
Files withFUJITSU LTD11
Top patents by PatentIndex Score
11 records- 0197US4815987AElectrical connectorFUJITSU LTD·Filed 1987·Granted Mar 28, 1989·198 cites·13 claims
- 0296US5854534AControlled impedence interposer substrateFUJITSU LTD·Filed 1995·Granted Dec 29, 1998·238 cites·23 claims
- 0389US5544017AMultichip module substrateFUJITSU LTD·Filed 1994·Granted Aug 6, 1996·91 cites·14 claims
- 0486US5017738AConnecting apparatusFUJITSU LTD·Filed 1990·Granted May 21, 1991·68 cites·7 claims
- 0585US6102710AControlled impedance interposer substrate and method of makingFUJITSU LTD·Filed 1998·Granted Aug 15, 2000·68 cites·18 claims
- 0684US4237606AMethod of manufacturing multilayer ceramic boardFUJITSU LTD·Filed 1978·Granted Dec 9, 1980·51 cites·15 claims
- 0777US4352533AConnector device for printed boardsFUJITSU LTD·Filed 1979·Granted Oct 5, 1982·30 cites·18 claims
- 0860US6539137B1Thermo-electric signal couplerFUJITSU LTD·Filed 2000·Granted Mar 25, 2003·8 cites·15 claims
- 0958US4998884AConnector apparatus for high density coaxial cablesFUJITSU LTD·Filed 1989·Granted Mar 12, 1991·20 cites·12 claims
- 1044US5778529AMethod of making a multichip module substrateFUJITSU LTD·Filed 1996·Granted Jul 14, 1998·10 cites·24 claims
- 1137US5181317AMethod of making an engineering change to a printed wiring boardFUJITSU LTD·Filed 1991·Granted Jan 26, 1993·9 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →