Inventor · disambiguated record
Tetsuya Nagaoka
Also filed as: NAGAOKA TETSUYA
4 granted patents·37 citations·filing 1990–2004
75Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0149US6960494B2Semiconductor package and method of manufacturing the sameTOSHIBA KK·Filed 2004·Granted Nov 1, 2005·4 cites·5 claims
- 0243US6836012B2Semiconductor package and method of manufacturing the sameTOSHIBA KK·Filed 2002·Granted Dec 28, 2004·2 cites·7 claims
- 0342US5045919APlastic packaged semiconductor device having bonding wires which are prevented from coming into contact with each other in plastic sealing stepTOSHIBA KK·Filed 1990·Granted Sep 3, 1991·21 cites·5 claims
- 0431US5292050AWire bonderKABUSHUKI KAISHA TOSHIBA·Filed 1992·Granted Mar 8, 1994·10 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →