Inventor · disambiguated record
Tetsuya Nakatsuka
Also filed as: NAKATSUKA TETSUYA
25 granted patents·7 pending applications·498 citations·filing 1997–2016
96Inventor score
Top patents by PatentIndex Score
32 records- 0194US6563225B2Product using Zn-Al alloy solderHITACHI LTD·Filed 2002·Granted May 13, 2003·110 cites·17 claims
- 0290US6872465B2SolderHITACHI LTD·Filed 2003·Granted Mar 29, 2005·45 cites·26 claims
- 0388US8022551B2Solder composition for electronic devicesRENESAS ELECTRONICS CORP·Filed 2006·Granted Sep 20, 2011·13 cites·11 claims
- 0488US7145236B2Semiconductor device having solder bumps reliably reflow solderableRENESAS TECH CORP·Filed 2002·Granted Dec 5, 2006·47 cites·7 claims
- 0587US8179631B2Magnetic disk drive feed-through solder connection with solder fillet formed inside base and protruding outside baseAOYAGI AKIHIKO·Filed 2008·Granted May 15, 2012·13 cites·9 claims
- 0687US6486411B2Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrateHITACHI LTD·Filed 2001·Granted Nov 26, 2002·43 cites·26 claims
- 0786US6555052B2Electron device and semiconductor deviceHITACHI LTD·Filed 2001·Granted Apr 29, 2003·42 cites·18 claims
- 0878US8503189B2Pb-free solder-connected structure and electronic deviceSHIMOKAWA HANAE·Filed 2010·Granted Aug 6, 2013·3 cites·11 claims
- 0977US6774490B2Electronic deviceHITACHI LTD·Filed 2003·Granted Aug 10, 2004·22 cites·10 claims
- 1076US7075183B2Electronic deviceHITACHI LTD·Filed 2001·Granted Jul 11, 2006·18 cites·9 claims
- 1175US5942185ALead-free solder used for connecting electronic parts on organic substrate and electronic products made using sameHITACHI LTD·Filed 1997·Granted Aug 24, 1999·37 cites·13 claims
- 1272US7013564B2Method of producing an electronic device having a PB free solder connectionHITACHI LTD·Filed 2001·Granted Mar 21, 2006·10 cites·19 claims
- 1372US6204490B1Method and apparatus of manufacturing an electronic circuit boardHITACHI LTD·Filed 1999·Granted Mar 20, 2001·33 cites·21 claims
- 1471US6585149B2Packaging method using lead-free solderHITACHI LTD·Filed 2001·Granted Jul 1, 2003·15 cites·17 claims
- 1570US7722962B2Solder foil, semiconductor device and electronic deviceRENESAS TECH CORP·Filed 2001·Granted May 25, 2010·18 cites·5 claims
- 1670US7709746B2Pb-free solder-connected structure and electronic deviceRENESAS TECH CORP·Filed 2006·Granted May 4, 2010·3 cites·13 claims
- 1769US7259465B2Semiconductor device with lead-free solderHITACHI LTD·Filed 2002·Granted Aug 21, 2007·12 cites·20 claims
- 1867US6960396B2Pb-free solder-connected structure and electronic deviceHITACHI LTD·Filed 2002·Granted Nov 1, 2005·7 cites·27 claims
- 1966US8699187B2Manufacturing method for a head-stack assembly, apparatus for interconnection of the head-stack assembly, and head-stack assemblyNAKAMURA TETSUYA·Filed 2009·Granted Apr 15, 2014·1 cites·6 claims
- 2061US8020747B2Soldering method and soldering apparatusHITACHI LTD·Filed 2009·Granted Sep 20, 2011·0 cites·7 claims
- 2160US8907475B2Pb-free solder-connected structureRENESAS ELECTRONICS CORP·Filed 2013·Granted Dec 9, 2014·0 cites·12 claims
- 2254US2010328815A1Magnetic disk deviceHITACHI LTD·Filed 2009·Application pending·0 cites
- 2352US7131566B2Packaging method using lead-free solderHITACHI LTD·Filed 2003·Granted Nov 7, 2006·4 cites·22 claims
- 2449US2006145352A1Electronic deviceHITACHI LTD·Filed 2006·Application pending·0 cites
- 2548US7911062B2Electronic component with varying rigidity leads using Pb-free solderHITACHI LTD·Filed 2007·Granted Mar 22, 2011·0 cites·30 claims
- 2646US7048173B2Wave soldering method using lead-free solder, apparatus therefor, and wave-soldered assemblyHITACHI LTD·Filed 2002·Granted May 23, 2006·2 cites·18 claims
- 2744US11244877B2Sealing structure and manufacturing method thereofHITACHI LTD·Filed 2016·Granted Feb 8, 2022·0 cites·6 claims
- 2844US2008062665A1Mounting structureNAKATSUKA TETSUYA·Filed 2007·Application pending·0 cites
- 2941US2008261001A1Mounting Substrate Suitable for Use to Install Surface Mount ComponentsNAKATSUKA TETSUYA·Filed 2005·Application pending·0 cites
- 3041US2004007384A1Electronic deviceHITACHI LTD·Filed 2003·Application pending·0 cites
- 3136US2006239855A1Reflow soldering method using Pb-free solder alloy and hybrid packaging method and structureNAKATSUKA TETSUYA·Filed 2004·Application pending·0 cites
- 3235US2002009610A1Technical fieldFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →