Inventor · disambiguated record
Tetsunori Niimi
Also filed as: NIIMI TETSUNORI
2 granted patents·1 pending application·21 citations·filing 1990–2008
60Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0179US7880317B2Semiconductor device and method of manufacturing semiconductor deviceSONY CORP·Filed 2006·Granted Feb 1, 2011·10 cites·12 claims
- 0242US2008185712A1Semiconductor device and method for manufacturing the sameSONY CORP·Filed 2008·Application pending·0 cites
- 0336US5113241ASemiconductor device mounted upon an insulating adhesive with silicon dioxide and nickel chromium steel filling particlesTOSHIBA KK·Filed 1990·Granted May 12, 1992·11 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →