Inventor · disambiguated record
Teruaki Nishinaka
Also filed as: NISHINAKA TERUAKI
15 granted patents·2 pending applications·474 citations·filing 1994–2022
93Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD7PANASONIC IP MAN CO LTD5PANASONIC CORP4ARITA KIYOSHI1
Top patents by PatentIndex Score
17 records- 0198US7629228B2Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masksPANASONIC CORP·Filed 2005·Granted Dec 8, 2009·155 cites·11 claims
- 0295US7488668B2Manufacturing method for semiconductor devices, arrangement determination method and apparatus for semiconductor device formation regions, and program for determining arrangement of semiconductor device formation regionsPANASONIC CORP·Filed 2005·Granted Feb 10, 2009·40 cites·24 claims
- 0386US5655704AMethod and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1995·Granted Aug 12, 1997·91 cites·11 claims
- 0485US5695667AMethod and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Dec 9, 1997·62 cites·20 claims
- 0584US9332681B2Electronic component mounting systemPANASONIC IP MAN CO LTD·Filed 2013·Granted May 3, 2016·5 cites·3 claims
- 0678US7797822B2Electronic component mounting methodPANASONIC CORP·Filed 2006·Granted Sep 21, 2010·10 cites·2 claims
- 0774US7107672B2Method of mounting electronic parts on a flexible printed circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Sep 19, 2006·22 cites·4 claims
- 0866US5894984AStructure of electronic parts and method of soldering electronic parts to substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Apr 20, 1999·31 cites·7 claims
- 0965US7989803B2Manufacturing method for semiconductor chips and semiconductor waferPANASONIC CORP·Filed 2006·Granted Aug 2, 2011·2 cites·20 claims
- 1064US6013899AMethod and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jan 11, 2000·24 cites·7 claims
- 1158US12247827B2Bead appearance inspection device, bead appearance inspection method, program, and bead appearance inspection systemPANASONIC IP MAN CO LTD·Filed 2022·Granted Mar 11, 2025·0 cites·7 claims
- 1256US5779958AMethod for packaging electronic deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jul 14, 1998·27 cites·3 claims
- 1353US2024357786A1Component replenishment work assist apparatus and component mounting apparatusPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
- 1453US2025056779A1Set-up assist apparatus and set-up assist methodPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
- 1545US9439336B2Component mounting systemPANASONIC IP MAN CO LTD·Filed 2014·Granted Sep 6, 2016·0 cites·6 claims
- 1637US8293652B2Substrate processing method, semiconductor chip manufacturing method, and resin-adhesive-layer-backed semiconductor chip manufacturing methodARITA KIYOSHI·Filed 2010·Granted Oct 23, 2012·0 cites·3 claims
- 1736US5548891AMethod of automatically mounting electronic connector onto an end of printed circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1994·Granted Aug 27, 1996·5 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →