Inventor · disambiguated record

Teruhisa Ohkawa

Also filed as: OHKAWA TERUHISA

2 granted patents·34 citations·filing 1988–1990

61Inventor score

Technology areasG01R H10W

Files withMITSUBISHI ELECTRIC CORP2

Top patents by PatentIndex Score

2 records

0159US4901203AHybrid integrated circuit module assemblyMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Feb 13, 1990·27 cites·3 claims
0227US5089874ASemiconductor device with infrared mapping markersMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Feb 18, 1992·7 cites·2 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →