Inventor · disambiguated record
Tetsuya Okishima
Also filed as: OKISHIMA TETSUYA
12 granted patents·162 citations·filing 1987–2008
93Inventor score
Top patents by PatentIndex Score
12 records- 0185US6728904B2Electronic circuit packageHITACHI LTD·Filed 2003·Granted Apr 27, 2004·21 cites·7 claims
- 0283US6223273B1Electronic circuit packageHITACHI LTD·Filed 1999·Granted Apr 24, 2001·39 cites·7 claims
- 0381US6584004B2Electronic circuit packageHITACHI LTD·Filed 2001·Granted Jun 24, 2003·17 cites·8 claims
- 0475US7425763B2Electronic circuit packageHITACHI LTD·Filed 2007·Granted Sep 16, 2008·3 cites·3 claims
- 0575US5468992AElectronic circuit package including plural bare chips mounted on a single wiring substrateHITACHI LTD·Filed 1992·Granted Nov 21, 1995·28 cites·11 claims
- 0671US7233534B2Electronic circuit packageHITACHI LTD·Filed 2005·Granted Jun 19, 2007·2 cites·6 claims
- 0770US5614761AElectronic circuit package including plural semiconductor chips formed on a wiring substrateHITACHI LTD·Filed 1995·Granted Mar 25, 1997·21 cites·15 claims
- 0864US5789805ASemiconductor multi-chip moduleHITACHI LTD·Filed 1996·Granted Aug 4, 1998·16 cites·71 claims
- 0959US7120069B2Electronic circuit packageHITACHI LTD·Filed 2004·Granted Oct 10, 2006·4 cites·84 claims
- 1056US7701743B2Electronic circuit packageRISING SILICON INC·Filed 2008·Granted Apr 20, 2010·0 cites·10 claims
- 1153US6195742B1Semiconductor multi-chip moduleHITACHI LTD·Filed 1998·Granted Feb 27, 2001·9 cites·23 claims
- 1230US4842899AProcess for forming metallic film on inorganic materialHITACHI CHEMICAL CO LTD·Filed 1987·Granted Jun 27, 1989·2 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →