Inventor · disambiguated record
Tean Wee Ong
Also filed as: ONG TEAN WEE
2 granted patents·1 pending application·2 citations·filing 2008–2014
44Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0155US8258019B2Flip chip assembly process for ultra thin substrate and package on package assemblyMONG WENG KHOON·Filed 2008·Granted Sep 4, 2012·2 cites·9 claims
- 0251US9397016B2Flip chip assembly process for ultra thin substrate and package on package assemblyINTEL CORP·Filed 2014·Granted Jul 19, 2016·0 cites·18 claims
- 0335US2016181222A1Pickhead for solder ball placement on an integrated circuit packageSOOD MOHIT·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →