Inventor · disambiguated record
Tetsuya Otsuki
Also filed as: OTSUKI TETSUYA
34 granted patents·11 pending applications·573 citations·filing 1994–2022
97Inventor score
Top patents by PatentIndex Score
45 records- 0191US5594282AResin sealing type semiconductor device and method of making the sameSEIKO EPSON CORP·Filed 1994·Granted Jan 14, 1997·106 cites·14 claims
- 0288US6133623AResin sealing type semiconductor device that includes a plurality of leads and method of making the sameSEIKO EPSON CORP·Filed 1997·Granted Oct 17, 2000·157 cites·26 claims
- 0382US10866260B2Physical quantity sensor, electronic apparatus, and vehicleSEIKO EPSON CORP·Filed 2018·Granted Dec 15, 2020·2 cites·17 claims
- 0481US10651819B2Vibrator device, oscillator, gyro sensor, electronic apparatus, and vehicleSEIKO EPSON CORP·Filed 2018·Granted May 12, 2020·2 cites·19 claims
- 0580US5624587ALaser machining apparatus and method of setting focus thereofMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Apr 29, 1997·38 cites·14 claims
- 0677US5653891AMethod of producing a semiconductor device with a heat sinkSEIKO EPSON CORP·Filed 1995·Granted Aug 5, 1997·48 cites·16 claims
- 0774US5801435AResin sealing type semiconductor device and method of making the sameSEIKO EPSON CORP·Filed 1996·Granted Sep 1, 1998·48 cites·19 claims
- 0873US7413975B2Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipmentSEIKO EPSON CORP·Filed 2006·Granted Aug 19, 2008·4 cites·29 claims
- 0972US11509288B2Vibrator device, oscillator, gyro sensor, electronic apparatus, and vehicleSEIKO EPSON CORP·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
- 1072US7696082B2Semiconductor device manufacturing method, semiconductor device, and wiring boardSEIKO EPSON CORP·Filed 2008·Granted Apr 13, 2010·3 cites·5 claims
- 1171US5891759AMethod of making a multiple heat sink resin sealing type semiconductor deviceSEIKO EPSON CORP·Filed 1996·Granted Apr 6, 1999·35 cites·14 claims
- 1270US9954160B2Wiring board, method of manufacturing the same, element housing package, electronic device, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2014·Granted Apr 24, 2018·3 cites·14 claims
- 1370US8537567B2Method of manufacturing electronic device and electronic deviceOTSUKI TETSUYA·Filed 2010·Granted Sep 17, 2013·2 cites·6 claims
- 1469US12034433B2Vibrator device, oscillator, gyro sensor, electronic apparatus, and vehicleSEIKO EPSON CORP·Filed 2022·Granted Jul 9, 2024·0 cites·14 claims
- 1569US5719442AResin sealing type semiconductor deviceSEIKO EPSON CORP·Filed 1995·Granted Feb 17, 1998·38 cites·21 claims
- 1668US11262374B2Sensor unit, method of manufacturing sensor unit, inertial measurement device, electronic apparatus, and vehicleSEIKO EPSON CORP·Filed 2018·Granted Mar 1, 2022·1 cites·19 claims
- 1760US11659664B2Electronic deviceSEIKO EPSON CORP·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 1860US5777380AResin sealing type semiconductor device having thin portions formed on the leadsSEIKO EPSON CORP·Filed 1996·Granted Jul 7, 1998·33 cites·5 claims
- 1960US5633529AResin sealing type semiconductor device and method of making the sameSEIKO EPSON CORP·Filed 1995·Granted May 27, 1997·26 cites·59 claims
- 2060US2023246197A1Positive electrode mixture for composite all-solid-state lithium sulfur batteryAIST·Filed 2021·Application pending·0 cites
- 2158US9474180B2Method of manufacturing electronic device and electronic deviceSEIKO EPSON CORP·Filed 2013·Granted Oct 18, 2016·0 cites·8 claims
- 2258US7372167B2Semiconductor device and method of manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2005·Granted May 13, 2008·1 cites·12 claims
- 2356US11688727B2Electronic deviceSEIKO EPSON CORP·Filed 2021·Granted Jun 27, 2023·0 cites·11 claims
- 2456US2010102423A1Semiconductor device manufacturing method, semiconductor device, and wiring boardSEIKO EPSON CORP·Filed 2009·Application pending·0 cites
- 2554US7541278B2Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipmentSEIKO EPSON CORP·Filed 2008·Granted Jun 2, 2009·0 cites·17 claims
- 2653US11776860B2Method of manufacturing electronic devices with a cap and moldingSEIKO EPSON CORP·Filed 2021·Granted Oct 3, 2023·0 cites·12 claims
- 2753US10615747B2Vibrator device, oscillator, electronic device, and vehicleSEIKO EPSON CORP·Filed 2018·Granted Apr 7, 2020·0 cites·13 claims
- 2851US2007094870A1Wiring board, method of manufacturing the same, semiconductor device, and electronic instrumentSEIKO EPSON CORP·Filed 2006·Application pending·0 cites
- 2950US10742169B2Oscillator, electronic apparatus, and vehicleSEIKO EPSON CORP·Filed 2018·Granted Aug 11, 2020·0 cites·20 claims
- 3049US11376770B2Method of manufacturing electronic deviceSEIKO EPSON CORP·Filed 2020·Granted Jul 5, 2022·0 cites·6 claims
- 3147US10340440B2Electronic device, method for producing electronic device, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2016·Granted Jul 2, 2019·0 cites·16 claims
- 3247US9769934B2Package base, package, electronic device, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2015·Granted Sep 19, 2017·0 cites·12 claims
- 3346US7189598B2Wiring board, method of manufacturing the same, semiconductor device, and electronic instrumentSEIKO EPSON CORP·Filed 2004·Granted Mar 13, 2007·2 cites·2 claims
- 3443US9065417B2Oscillation device and method for manufacturing oscillation deviceOTSUKI TETSUYA·Filed 2012·Granted Jun 23, 2015·0 cites·10 claims
- 3543US6595685B2Method and apparatus for measuring thermophysical propertiesNAT RES LAB OF METROLOGY·Filed 1999·Granted Jul 22, 2003·16 cites·2 claims
- 3642US2004237296A1Wiring board, method of manufacturing the same, semiconductor device, and electronic instrumentFiled 2004·Application pending·0 cites
- 3741US5610852AFerroelectric memory and method for controlling operation of the sameNEC CORP·Filed 1996·Granted Mar 11, 1997·8 cites·38 claims
- 3841US2004135269A1Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipmentSEIKO EPSON CORP·Filed 2003·Application pending·0 cites
- 3941US2015070855A1Circuit board, method for manufacturing circuit board, electronic device, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2014·Application pending·0 cites
- 4041US2011210408A1Sensor device, method of manufacturing sensor device, motion sensor, and method of manufacturing motion sensorSEIKO EPSON CORP·Filed 2011·Application pending·0 cites
- 4141US2006049519A1Semiconductor device and method for manufacturing semiconductor deviceSEIKO EPSON CORP·Filed 2005·Application pending·0 cites
- 4240US9088262B2Vibrating device, method for manufacturing vibrating device, and electronic apparatusOTSUKI TETSUYA·Filed 2012·Granted Jul 21, 2015·0 cites·9 claims
- 4339US2016033431A1Thermal diffusivity measuring deviceBETHEL CO LTD·Filed 2014·Application pending·0 cites
- 4438US2012318059A1Sensor device and manufacturing method thereofOTSUKI TETSUYA·Filed 2012·Application pending·0 cites
- 4529US2015223325A1Wiring board, method of manufacturing wiring board, electronic device, electronic apparatus, and moving objectSEIKO EPSON CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →