Inventor · disambiguated record
Teppo Syrjänen
Also filed as: SYRJAENEN TEPPO · SYRJANEN TEPPO · SYRJÄNEN TEPPO
3 granted patents·6 pending applications·2 citations·filing 2001–2025
51Inventor score
Top patents by PatentIndex Score
9 records- 0165US2024381598A1Shielded electronic componentMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0259US2024391759A1Mems component with upside-down chipMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0359US2025361143A1Component with improved adhesive bleed-out clearanceMURATA MANUFACTURING CO·Filed 2025·Application pending·0 cites
- 0456US12075603B2Shielded electronic componentMURATA MANUFACTURING CO·Filed 2022·Granted Aug 27, 2024·0 cites·8 claims
- 0552US2025070040A1Electronic component, circuit board and methodMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0646US2023360945A1Electronic component with aligned dieMURATA MANUFACTURING CO·Filed 2023·Application pending·0 cites
- 0744US12075605B2Electronic component with internal shieldingMURATA MANUFACTURING CO·Filed 2022·Granted Aug 27, 2024·0 cites·7 claims
- 0830US6835115B2Grinding methodROLLTEST OY·Filed 2003·Granted Dec 28, 2004·2 cites·6 claims
- 0920US2002090890A1Grinding methodROLLTEST OY·Filed 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Teppo Syrjänen files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →