Inventor · disambiguated record
Teck Yang Tan
Also filed as: TAN TECK YANG
3 granted patents·23 citations·filing 2007–2012
66Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0176US8643164B2Package-on-package technology for fan-out wafer-level packagingKAUFMANN MATTHEW VERNON·Filed 2009·Granted Feb 4, 2014·13 cites·20 claims
- 0275US7834449B2Highly reliable low cost structure for wafer-level ball grid array packagingBROADCOM CORP·Filed 2007·Granted Nov 16, 2010·9 cites·25 claims
- 0356US9287189B2Flexible routing for chip on board applicationsBROADCOM CORP·Filed 2012·Granted Mar 15, 2016·1 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →