Inventor · disambiguated record
Teck Tiong Tan
Also filed as: TAN TECK T · TAN TECK TIONG
4 granted patents·5 pending applications·18 citations·filing 2004–2021
67Inventor score
Files withADVANPACK SOLUTIONS PTE LTD4JCET SEMICONDUCTOR SHAOXING CO LTD2ADVANPACK SOLUTION PTES LTD1DELPHI TECH INC1STATS CHIPPAC LTD1
Top patents by PatentIndex Score
9 records- 0175US7294827B2Electronic module with light-blocking featuresDELPHI TECH INC·Filed 2004·Granted Nov 13, 2007·17 cites·24 claims
- 0268US12148677B2Semiconductor device and method of forming ultra high density embedded semiconductor die packageJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2021·Granted Nov 19, 2024·0 cites·20 claims
- 0361US9627338B2Semiconductor device and method of forming ultra high density embedded semiconductor die packageSTATS CHIPPAC LTD·Filed 2014·Granted Apr 18, 2017·1 cites·24 claims
- 0450US11227809B2Semiconductor device and method of forming ultra high density embedded semiconductor die packageJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2017·Granted Jan 18, 2022·0 cites·25 claims
- 0543US2006180888A1Optical sensor package and method of manufactureADVANPACK SOLUTIONS PTE LTD·Filed 2005·Application pending·0 cites
- 0641US2008150107A1Flip chip in package using flexible and removable leadframeADVANPACK SOLUTION PTES LTD·Filed 2008·Application pending·0 cites
- 0739US2007284420A1Integrated circuit chip formed on substrateADVANPACK SOLUTIONS PTE LTD·Filed 2006·Application pending·0 cites
- 0838US2007196979A1Flip chip in package using flexible and removable leadframeADVANPACK SOLUTIONS PTE LTD·Filed 2006·Application pending·0 cites
- 0936US2006103016A1Heat sinking structureADVANPACK SOLUTIONS PTE LTD·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →