Inventor · disambiguated record
Terrence Huat Hin Tan
Also filed as: TAN TERRENCE HUAT HIN
5 granted patents·1 citations·filing 2016–2023
61Inventor score
Top patents by PatentIndex Score
5 records- 0162US11257560B2Test architecture for die to die interconnect for three dimensional integrated circuitsINTEL CORP·Filed 2017·Granted Feb 22, 2022·1 cites·9 claims
- 0254US12474401B2Systems and methods for isolating faults in die-to-die interconnectsMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 0331US10139445B2High speed I/O pinless structural testingINTEL CORP·Filed 2016·Granted Nov 27, 2018·0 cites·20 claims
- 0430US11476168B2Die stack override for die testingINTEL CORP·Filed 2018·Granted Oct 18, 2022·0 cites·23 claims
- 0527US10236076B2Methods and apparatus for predictable protocol aware testing on memory interfaceINTEL CORP·Filed 2016·Granted Mar 19, 2019·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →