Inventor · disambiguated record
Tetsuyuki Tsuchida
Also filed as: TSUCHIDA TETSUYUKI
6 granted patents·2 pending applications·5 citations·filing 2014–2023
68Inventor score
Top patents by PatentIndex Score
8 records- 0181US10923439B2Core substrate, multi-layer wiring substrate, semiconductor package, semiconductor module, copper-clad substrate, and method for manufacturing core substrateTOPPAN PRINTING CO LTD·Filed 2019·Granted Feb 16, 2021·5 cites·15 claims
- 0262US12342473B2Wiring board and method of producing wiring boardTOPPAN INC·Filed 2023·Granted Jun 24, 2025·0 cites·7 claims
- 0360US9572252B2Wiring substrate and method of manufacturing wiring substrateTOPPAN PRINTING CO LTD·Filed 2014·Granted Feb 14, 2017·0 cites·6 claims
- 0457US11756846B2Glass core, multilayer circuit board, and method of manufacturing glass coreTOPPAN PRINTING CO LTD·Filed 2020·Granted Sep 12, 2023·0 cites·10 claims
- 0557US2023422412A1Multilayer wiring boardTOPPAN INC·Filed 2023·Application pending·0 cites
- 0655US11516907B2Glass wiring boardTOPPAN PRINTING CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·7 claims
- 0733US2018192510A1Wiring substrate and method for manufacturing the sameTOPPAN PRINTING CO LTD·Filed 2017·Application pending·0 cites
- 0831US9883586B2Wiring substrate for bonding using solder having a low melting point and method for manufacturing sameTOPPAN PRINTING CO LTD·Filed 2015·Granted Jan 30, 2018·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →