Inventor · disambiguated record
Tetsuya Uebayashi
Also filed as: UEBAYASHI TETSUYA
11 granted patents·1 pending application·65 citations·filing 2001–2020
89Inventor score
Files withRENESAS TECH CORP6SKYWORKS FILTER SOLUTIONS JAPAN CO LTD4MITSUBISHI ELECTRIC CORP1YAMASHITA KUNIHIRO1
Top patents by PatentIndex Score
12 records- 0189US10999932B2Electronic package including cavity defined by resin and method of forming sameSKYWORKS FILTER SOLUTIONS JAPAN CO LTD·Filed 2019·Granted May 4, 2021·5 cites·19 claims
- 0282US10574202B2Electronic package including cavity formed by removal of sacrificial material from within a capSKYWORKS FILTER SOLUTIONS JAPAN CO LTD·Filed 2017·Granted Feb 25, 2020·2 cites·20 claims
- 0377US11545952B2Electronic package including cavity formed by removal of sacrificial material from within a capSKYWORKS FILTER SOLUTIONS JAPAN CO LTD·Filed 2020·Granted Jan 3, 2023·1 cites·20 claims
- 0468US10321572B2Electronic package including cavity defined by resin and method of forming sameSKYWORKS FILTER SOLUTIONS JAPAN CO LTD·Filed 2017·Granted Jun 11, 2019·1 cites·13 claims
- 0568US8318548B2Method for manufacturing semiconductor deviceYAMASHITA KUNIHIRO·Filed 2010·Granted Nov 27, 2012·5 cites·12 claims
- 0668US6737736B2Semiconductor deviceRENESAS TECH CORP·Filed 2001·Granted May 18, 2004·13 cites·7 claims
- 0767US6965154B2Semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Nov 15, 2005·12 cites·8 claims
- 0866US6995468B2Semiconductor apparatus utilizing a preparatory stage for a chip assemblyRENESAS TECH CORP·Filed 2004·Granted Feb 7, 2006·11 cites·2 claims
- 0957US6784021B2Semiconductor device, method of fabricating the same and semiconductor device fabricating apparatusRENESAS TECH CORP·Filed 2002·Granted Aug 31, 2004·6 cites·4 claims
- 1056US7028397B2Method of attaching a semiconductor chip to a chip mounting substrateRENESAS TECH CORP·Filed 2002·Granted Apr 18, 2006·7 cites·5 claims
- 1146US6867507B2Lead frameRENESAS TECH CORP·Filed 2002·Granted Mar 15, 2005·2 cites·15 claims
- 1236US2003054591A1Semiconductor device, and method of manufacturing the semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →