Inventor · disambiguated record
Tetsuya Ueda
Also filed as: UEDA TETSUYA
109 granted patents·29 pending applications·3,058 citations·filing 1987–2024
99Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD41MITSUBISHI ELECTRIC CORP36PANASONIC CORP13UNIVERSAL BIO RESEARCH CO LTD7UEDA TETSUYA6
Top patents by PatentIndex Score
138 records- 0198US5125358AMicrowave plasma film deposition systemMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1989·Granted Jun 30, 1992·353 cites·2 claims
- 0297US7473632B2Semiconductor device with an air gap between lower interconnections and a connection portion to the lower interconnections not formed adjacent to the air gapPANASONIC CORP·Filed 2005·Granted Jan 6, 2009·45 cites·10 claims
- 0397US5969426ASubstrateless resin encapsulated semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Oct 19, 1999·262 cites·11 claims
- 0495US7830014B2Method for fabricating semiconductor device and semiconductor devicePANASONIC CORP·Filed 2010·Granted Nov 9, 2010·17 cites·8 claims
- 0595US5592019ASemiconductor device and moduleMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Jan 7, 1997·341 cites·12 claims
- 0694US7749891B2Method and fabricating semiconductor device and semiconductor devicePANASONIC CORP·Filed 2009·Granted Jul 6, 2010·20 cites·7 claims
- 0794US4849617ASemiconductor card which can be foldedMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Jul 18, 1989·110 cites·6 claims
- 0892US5760429AMulti-layer wiring structure having varying-sized cutoutsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jun 2, 1998·132 cites·15 claims
- 0991US8502385B2Power semiconductor deviceOKA SEIJI·Filed 2011·Granted Aug 6, 2013·14 cites·10 claims
- 1091US6071755AMethod of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Jun 6, 2000·101 cites·8 claims
- 1191US5004899ASemiconductor card which can be foldedMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Apr 2, 1991·80 cites·5 claims
- 1290US7740987B2Fuel cell cogeneration system, method of operatingPANASONIC CORP·Filed 2009·Granted Jun 22, 2010·12 cites·15 claims
- 1389US10566016B2Flexure of hard disk driveNHK SPRING CO LTD·Filed 2018·Granted Feb 18, 2020·9 cites·8 claims
- 1489US7052790B2Fuel cell system and operation method having a condensed water tank open to atmosphereMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 30, 2006·35 cites·20 claims
- 1588US8669833B2Three-dimensional metamaterial having function of allowing and inhibiting propagation of electromagnetic wavesUEDA TETSUYA·Filed 2010·Granted Mar 11, 2014·8 cites·7 claims
- 1688US8294538B2Transmission line microwave apparatus including at least one non-reciprocal transmission line part between two partsUEDA TETSUYA·Filed 2008·Granted Oct 23, 2012·14 cites·15 claims
- 1788US5031026AThin semiconductor cardMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Jul 9, 1991·64 cites·11 claims
- 1887US9054406B2Nonreciprocal transmission line apparatus having asymmetric structure of transmission lineUEDA TETSUYA·Filed 2012·Granted Jun 9, 2015·10 cites·37 claims
- 1987US8034707B2Method for fabricating semiconductor device and semiconductor devicePANASONIC CORP·Filed 2010·Granted Oct 11, 2011·6 cites·13 claims
- 2087US7772709B2Resin sealed semiconductor device and manufacturing method thereforMITSUBISHI ELECTRIC CORP·Filed 2008·Granted Aug 10, 2010·17 cites·12 claims
- 2187US6972119B2Apparatus for forming hydrogenMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Dec 6, 2005·25 cites·4 claims
- 2286US10879611B2Antenna deviceDENSO CORP·Filed 2018·Granted Dec 29, 2020·6 cites·9 claims
- 2385US6455436B1Method of fabricating semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Sep 24, 2002·31 cites·5 claims
- 2485US4838804AMechanism for connecting IC card and external deviceMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Jun 13, 1989·51 cites·12 claims
- 2584US8947317B2Microwave resonator configured by composite right/left-handed meta-material and antenna apparatus provided with the microwave resonatorUEDA TETSUYA·Filed 2011·Granted Feb 3, 2015·13 cites·13 claims
- 2684US5334872AEncapsulated semiconductor device having a hanging heat spreading plate electrically insulated from the die padMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Aug 2, 1994·80 cites·6 claims
- 2784US4949158ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Aug 14, 1990·65 cites·7 claims
- 2883US10976253B2Absorbance measuring device and method thereofUNIVERSAL BIO RESEARCH CO LTD·Filed 2016·Granted Apr 13, 2021·2 cites·12 claims
- 2983US7718290B2Cogeneration systemPANASONIC CORP·Filed 2006·Granted May 18, 2010·6 cites·9 claims
- 3080US11332704B2Culture device, culture system, and culture methodUNIVERSAL BIO RESEARCH CO LTD·Filed 2014·Granted May 17, 2022·2 cites·25 claims
- 3180US9184316B2Solid-state imaging apparatus and method for manufacturing samePANASONIC CORP·Filed 2014·Granted Nov 10, 2015·2 cites·12 claims
- 3280US5576247AThin layer forming method wherein hydrophobic molecular layers preventing a BPSG layer from absorbing moistureMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Nov 19, 1996·71 cites·3 claims
- 3379US9300891B2Solid-state imaging device and method of manufacturing the samePANASONIC CORP·Filed 2014·Granted Mar 29, 2016·5 cites·15 claims
- 3479US5157478ATape automated bonding packaged semiconductor device incorporating a heat sinkMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Oct 20, 1992·65 cites·23 claims
- 3579US4764803AThin semiconductor cardMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Aug 16, 1988·37 cites·8 claims
- 3678US6545361B2Semiconductor device having multilevel interconnection structure and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Apr 8, 2003·23 cites·4 claims
- 3778US6300242B1Semiconductor device and method of fabricating the sameMATSUSHITA ELECTRONICS CORP·Filed 2000·Granted Oct 9, 2001·24 cites·27 claims
- 3878US5327012ASemiconductor device having a double-layer interconnection structureMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1992·Granted Jul 5, 1994·60 cites·11 claims
- 3977US5083191ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Jan 21, 1992·49 cites·10 claims
- 4077US4864116AMechanism for connecting an IC card to an external deviceMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Sep 5, 1989·37 cites·9 claims
- 4176US9556477B2Light measurement apparatus for reaction vessel and light measurement methodUNIVERSAL BIO RESEARCH CO LTD·Filed 2013·Granted Jan 31, 2017·3 cites·12 claims
- 4275US6252427B1CMOS inverter and standard cell using the sameMATSUSHITA ELECTRONICS CORP·Filed 1999·Granted Jun 26, 2001·37 cites·14 claims
- 4375US6242336B1Semiconductor device having multilevel interconnection structure and method for fabricating the sameMATSUSHITA ELECTRONICS CORP·Filed 1998·Granted Jun 5, 2001·41 cites·14 claims
- 4474US7011901B2Fuel cell generation system and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Mar 14, 2006·12 cites·7 claims
- 4573US7811712B2Fuel cell system and operation method thereofPANASONIC CORP·Filed 2005·Granted Oct 12, 2010·2 cites·9 claims
- 4673US4865193ATape carrier for tape automated bonding process and a method of producing the sameMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Sep 12, 1989·40 cites·4 claims
- 4772US5180436AMicrowave plasma film deposition systemMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1991·Granted Jan 19, 1993·24 cites·5 claims
- 4871US10288606B2Analysis method and analysis kit for simultaneously detecting or quantitating multiple types of target substancesUNIVERSAL BIO RESEARCH CO LTD·Filed 2013·Granted May 14, 2019·1 cites·8 claims
- 4971US9115418B2Method of recovering platinum group elementsNAKAMURA YUZURU·Filed 2012·Granted Aug 25, 2015·2 cites·12 claims
- 5069US6727011B2Fuel cell system and method of operating fuel cell systemMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Apr 27, 2004·9 cites·21 claims
Showing the top 50 of 138 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →