Inventor · disambiguated record
Tetsuo Usami
Also filed as: USAMI TETSUO
3 granted patents·2 pending applications·5 citations·filing 2001–2006
55Inventor score
Top patents by PatentIndex Score
5 records- 0148US6835660B2Method of manufacturing semiconductor device having metal alloy interconnection that has excellent EM lifetimeOKI ELECTRIC IND CO LTD·Filed 2003·Granted Dec 28, 2004·5 cites·16 claims
- 0240US2007032075A1Deposition method for wiring thin filmUSAMI TETSUO·Filed 2006·Application pending·0 cites
- 0333US7135399B2Deposition method for wiring thin filmOKI ELECTRIC IND CO LTD·Filed 2001·Granted Nov 14, 2006·0 cites·12 claims
- 0428US6777328B2Method of forming multilayered conductive layers for semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2002·Granted Aug 17, 2004·0 cites·15 claims
- 0527US2004203230A1Semiconductor device having multilayered conductive layersFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →