Inventor · disambiguated record
Tetsuaki Utsumi
Also filed as: UTSUMI TETSUAKI
34 granted patents·6 pending applications·78 citations·filing 2007–2025
95Inventor score
Top patents by PatentIndex Score
40 records- 0198US11756634B2Semiconductor memory deviceKIOXIA CORP·Filed 2022·Granted Sep 12, 2023·2 cites·19 claims
- 0297US10276585B2Semiconductor memory deviceTOSHIBA MEMORY CORP·Filed 2017·Granted Apr 30, 2019·31 cites·27 claims
- 0396US10672782B2Semiconductor memory deviceTOSHIBA MEMORY CORP·Filed 2019·Granted Jun 2, 2020·10 cites·16 claims
- 0495US11488675B2Semiconductor memory deviceKIOXIA CORP·Filed 2021·Granted Nov 1, 2022·3 cites·17 claims
- 0595US11127441B1Semiconductor storage deviceKIOXIA CORP·Filed 2020·Granted Sep 21, 2021·4 cites·18 claims
- 0694US9953993B2Semiconductor memory deviceTOSHIBA MEMORY CORP·Filed 2017·Granted Apr 24, 2018·12 cites·20 claims
- 0790US2025061953A1Semiconductor memory deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 0889US11081492B2Semiconductor memory deviceTOSHIBA MEMORY CORP·Filed 2020·Granted Aug 3, 2021·2 cites·20 claims
- 0985US12159678B2Semiconductor memory deviceKIOXIA CORP·Filed 2023·Granted Dec 3, 2024·0 cites·20 claims
- 1078US12315844B2Semiconductor memory deviceKIOXIA CORP·Filed 2022·Granted May 27, 2025·0 cites·17 claims
- 1178US2024304602A1Semiconductor memory deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 1277US12062704B2Semiconductor memory deviceKIOXIA CORP·Filed 2023·Granted Aug 13, 2024·0 cites·11 claims
- 1372US11929352B2Semiconductor memory device having transistors between bonding pads and word linesKIOXIA CORP·Filed 2022·Granted Mar 12, 2024·0 cites·18 claims
- 1472US11903210B2Semiconductor memory deviceKIOXIA CORP·Filed 2021·Granted Feb 13, 2024·0 cites·17 claims
- 1571US11121147B2Semiconductor storage deviceTOSHIBA MEMORY CORP·Filed 2019·Granted Sep 14, 2021·2 cites·9 claims
- 1670US12132040B2Semiconductor storage deviceKIOXIA CORP·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 1769US2025254867A1Semiconductor device, semiconductor storage device, and method of manufacturing semiconductor deviceKIOXIA CORP·Filed 2025·Application pending·0 cites
- 1868US11769808B2Semiconductor memory deviceKIOXIA CORP·Filed 2021·Granted Sep 26, 2023·0 cites·16 claims
- 1968US11508697B2Semiconductor memory deviceKIOXIA CORP·Filed 2020·Granted Nov 22, 2022·0 cites·13 claims
- 2068US10832776B2Semiconductor device and semiconductor memory deviceTOSHIBA MEMORY CORP·Filed 2019·Granted Nov 10, 2020·2 cites·17 claims
- 2167US12232325B2Semiconductor storage deviceKIOXIA CORP·Filed 2021·Granted Feb 18, 2025·0 cites·6 claims
- 2266US11862288B2Semiconductor storage deviceKIOXIA CORP·Filed 2021·Granted Jan 2, 2024·0 cites·20 claims
- 2366US11121227B2Semiconductor memory deviceKIOXIA CORP·Filed 2020·Granted Sep 14, 2021·0 cites·15 claims
- 2466US7962883B2Developing semiconductor circuit design with conditional flipflops to save power consumptionTOSHIBA KK·Filed 2008·Granted Jun 14, 2011·3 cites·10 claims
- 2563US12310006B2Semiconductor device, semiconductor storage device, and method of manufacturing semiconductor deviceKIOXIA CORP·Filed 2021·Granted May 20, 2025·0 cites·18 claims
- 2663US8533646B1Apparatus, method and medium storing program for designing semiconductor integrated circuitONOZAKI YASUTOMO·Filed 2012·Granted Sep 10, 2013·3 cites·13 claims
- 2762US2025280547A1Memory deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 2861US9391017B2Semiconductor integrated circuitTOSHIBA KK·Filed 2013·Granted Jul 12, 2016·1 cites·21 claims
- 2959US7831947B2Semiconductor layout design apparatus, semiconductor layout design method and computer readable mediumTOSHIBA KK·Filed 2007·Granted Nov 9, 2010·2 cites·20 claims
- 3058US11710727B2Semiconductor storage deviceKIOXIA CORP·Filed 2020·Granted Jul 25, 2023·0 cites·20 claims
- 3157US11538791B2Semiconductor memory device including a memory chip and a circuit chip bonded to the memory chipKIOXIA CORP·Filed 2020·Granted Dec 27, 2022·0 cites·17 claims
- 3256US11495543B2Semiconductor device capable of preventing an increase in the number of manufacturing steps relating to wiring and a method for manufacturing the sameKIOXIA CORP·Filed 2020·Granted Nov 8, 2022·0 cites·19 claims
- 3352US9069921B2Verification apparatus for semiconductor integrated circuit, verification method for semiconductor integrated circuit, and program thereforTOSHIBA KK·Filed 2014·Granted Jun 30, 2015·0 cites·12 claims
- 3446US7836421B2Semiconductor layout design apparatus and method for evaluating a floorplan using distances between standard cells and macrocellsTOSHIBA KK·Filed 2007·Granted Nov 16, 2010·0 cites·20 claims
- 3540US8751992B2Power supply wiring structureUTSUMI TETSUAKI·Filed 2012·Granted Jun 10, 2014·1 cites·7 claims
- 3639US9748240B2Semiconductor device including a boundary of conductivity in a substrateTOSHIBA MEMORY CORP·Filed 2016·Granted Aug 29, 2017·0 cites·19 claims
- 3738US9947680B2Semiconductor memory deviceTOSHIBA MEMORY CORP·Filed 2017·Granted Apr 17, 2018·0 cites·19 claims
- 3838US8614515B2Wiring method for semiconductor integrated circuit, semiconductor-circuit wiring apparatus and semiconductor integrated circuitUTSUMI TETSUAKI·Filed 2011·Granted Dec 24, 2013·0 cites·20 claims
- 3937US2010237508A1Power-supply wiring structure for multilayer wiring and method of manufacturing multilayer wiringTOSHIBA KK·Filed 2010·Application pending·0 cites
- 4031US2015358004A1D-type flip-flop and clock generating circuitTOSHIBA KK·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →